Invensense, Inc.

Sitime Corporation

Chamartin Laboratories LLC

Renata Melamud Berger

Markus Lutz

Aaron Partridge

Paul Merritt Hagelin

Charles I Grosjean

Ginel C Hill

Nikhil Apte

Michael Julian Daneman

Joseph C Doll

Aleksey Sergeyevich Khenkin

Julius Ming-Lin Tsai

Sushil Bharatan

Stephen Lloyd

Jeremy Parker

Cristiano Dalvi

Kate LeeAnn Bechtel

Aaron John Zilkie

Sean Merritt

Guomin Yu

Andrew George Rickman

Baris Cagdaser

Hooman Abediasl

James Christian Salvia

Omid Oliaei

Evan Einbender Aamodt

Mei-Lin Chan

Thomas Chen

Breanna Stachowski

Benjamin Ver Steeg

Eldwin Ng

Alexander Gondarenko

Richard Grote

Lok Man Chu

Alexander Fast

Roozbeh Parsa

Vafa Jamali

Adam Scofield

Todd Andrew Newhouse

Patrick John Castagna

Suresh Chengalva

Jeffrey Driscoll

Craig Gadd

Christopher Alan Harris

Haydn Frederick Jones

Vishwas Kulkarni

Adrian Williamson Bahani

Jennifer Lynn Corso

Ferdyan Lesmana

A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.

Non-lid-bonded MEMS resonator with phosphorus dopant

A wearable device. In some embodiments, the wearable device includes: a sensing module; and a strap attached to the sensing module, the wearable device being configured to be worn by a user, with a lower surface of the sensing module in contact with the user, the strap extending over an upper surface of the sensing module.

Wearable device

The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 10cm, and preferably between 10cmand 10cm.

Resonant elements and oscillators

MEMS resonator with colocated temperature sensor

MEMS resonator with beam segments having predefined angular offset to each other and to resonator silicon crystal orientation

Multi-die integrated circuit package

MEMS resonator with co-located temperature sensor

An electronic device includes a substrate layer having a front surface and a back surface opposite the front surface, a plurality of ultrasonic transducers formed on the front surface of the substrate layer, wherein the plurality of ultrasonic transducers generate backward waves during operation, the backward waves propagating through the substrate layer, and a plurality of substrate structures formed within the back surface of the substrate layer, the plurality of substrate structures configured to modify the backward waves during the operation.

Reflection minimization for sensor

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane configured to allow movement at ultrasonic frequencies. The membrane comprises a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. For operation in a Capacitive Micromachined Ultrasonic Transducer (CMUT) mode, a third electrode is disposed on the substrate and separated by an air gap in the cavity from the second electrode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/CMUT dual-mode devices, and a PMUT/CMUT dual-mode device.

Supplemental sensor modes and systems for ultrasonic transducers

An electronic device comprises a CMOS substrate having a first surface and a second surface opposite the first surface. A plurality of ultrasonic transducers is provided having a transmit/receive surface. A contact surface is piezoelectrically associated with the plurality of ultrasonic transducers and is formed on the first surface of the CMOS substrate. The plurality of ultrasonic transducers is disposed on the second surface of the CMOS substrate, with the transmit/receive side attached to the second surface thereof such that the CMOS substrate is between the plurality of ultrasonic transducers and the platen. An image sensing system is also provided, together with a method for ultrasonic sensing in the electronic device.

Ultrasonic sensing device

In a method of operating a two-dimensional array of ultrasonic transducers, a plurality of array positions comprising pluralities of ultrasonic transducers of the two-dimensional array of ultrasonic transducers is defined, the plurality of array positions each comprising a portion of ultrasonic transducers of the two dimensional array of ultrasonic transducers. For each array position of the plurality of array positions, a plurality of ultrasonic transducers associated with the respective array position are activated. The activation includes transmitting ultrasonic signals from a first group of ultrasonic transducers of the plurality of ultrasonic transducers, wherein at least some ultrasonic transducers of the first group of ultrasonic transducers are phase delayed with respect to other ultrasonic transducers of the first group of ultrasonic transducers, the first group of ultrasonic transducers for forming a focused ultrasonic beam. The activation also includes receiving reflected ultrasonic signals at a second group of ultrasonic transducers of the plurality of ultrasonic transducers.

Operating a two-dimensional array of ultrasonic transducers

A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device includes a substrate, an edge support structure connected to the substrate, and a membrane connected to the edge support structure such that a cavity is defined between the membrane and the substrate, the membrane configured to allow movement at ultrasonic frequencies, the membrane having non-uniform stiffness. The membrane includes a piezoelectric layer, a first electrode and a second electrode coupled to opposing sides of the piezoelectric layer, and a mechanical support layer coupled to one of the first electrode and the second electrode.

Ultrasonic transducer with a non-uniform membrane

Dual-resonator semiconductor die

Growing community of inventors

Palo Alto, CA, United States of America

Renata Melamud Berger