International Business Machines Corporation

Globalfoundries Inc.

Globalfoundries U.S. Inc.

Renata A Camillo-Castillo

Vibhor Jain

Qizhi Liu

Marwan H Khater

Anthony K Stamper

David Louis Harame

Vikas Kumar Kaushal

Richard A Phelps

Robert J Gauthier, Jr

Alvin Jose Joseph

John Joseph Pekarik

Erik Mattias Dahlstrom

Yun Shi

Andreas Daniel Stricker

Peter B Gray

Robert Mark Rassel

James Stuart Dunn

Ephrem G Gebreselasie

Ramana Murty Malladi

Peng Cheng

Jeffrey P Gambino

Jed Hickory Rankin

Jeffrey Bowman Johnson

Hanyi Ding

Alan Bernard Botula

Santosh Sharma

Douglas Brian Hershberger

Mark E Stidham

John J Ellis-Monaghan

Terence B Hook

James William Adkisson

Zhong-Xiang He

Mark David Jaffe

Xuefeng Liu

Xusheng Kevin Wu

Natalie Barbara Feilchenfeld

Daniel Scott Vanslette

Russell T Herrin

Mattias E Dahlstrom

According to a semiconductor device herein, the device includes a substrate. An active device is formed in the substrate. The active device includes a collector region, a base region formed on the collector region, and an emitter region formed on the base region. An isolation structure is formed in the substrate around the active device. A trench filled with a compressive material is formed in the substrate and positioned laterally adjacent to the emitter region and base region. The trench extends at least partially into the collector region.

Heterojunction bipolar transistors with stress material for improved mobility

A device structure for a bipolar junction transistor includes a base layer made of a semiconductor material. An emitter is disposed on a first portion of the base layer. A dopant-containing layer is disposed on a second portion of the base layer. A hardmask is disposed on the base layer. The hardmask includes a window aligned with the second portion of the base layer. Deposits of the dopant-containing layer are limited to exposed surfaces of: the first portion that is disposed on a top surface of the base layer inside of the window.

Extrinsic base doping for bipolar junction transistors

According to a semiconductor device herein, the device includes a substrate. An active device is formed in the substrate. The active device includes a collector region, a base region formed on the collector region, and an emitter region formed on the base region. An isolation structure is formed in the substrate around the active device. A trench filled with a compressive material is formed in the substrate and positioned laterally adjacent to the emitter region and base region. The trench extends at least partially into the base region.

A method includes forming a base layer on a top surface of a substrate. A dielectric layer is formed on exposed surfaces of the base layer. A hardmask layer is formed on the base layer and the dielectric layer. A pattern is formed from the hardmask with a first opening and a second opening. Portions of a dielectric layer are removed from the top surface of the base layer at positions consistent with the pattern of the first opening and the second opening to form exposed surfaces defined as a first window and a second window in the dielectric layer. Deposits of a dopant-containing layer are limited on the exposed surfaces of: a first portion on the top surface of the base layer inside of the first window, and a second portion on the top surface of the base layer inside of the second window.

Methods for forming a device structure and device structures using a silicon-on-insulator substrate that includes a high-resistance handle wafer. A doped region is formed in the high-resistance handle wafer. A first trench is formed that extends through a device layer and a buried insulator layer of the silicon-on-insulator substrate to the high-resistance handle wafer. The doped region includes lateral extension of the doped region extending laterally of the first trench. A semiconductor layer is epitaxially grown within the first trench, and a device structure is formed using at least a portion of the semiconductor layer. A second trench is formed that extends through the device layer and the buried insulator layer to the lateral extension of the doped region, and a conductive plug is formed in the second trench. The doped region and the plug comprise a body contact.

Device structures for a silicon-on-insulator substrate with a high-resistance handle wafer

Device structure and fabrication methods for a bipolar junction transistor. A base layer is formed and an emitter is formed on a first portion of the base layer. A dopant-containing layer is deposited on a second portion of the base layer. Dopant is transferred from the dopant-containing layer into the second portion of the base layer to define an extrinsic base of the device structure.

Device structures for a bipolar junction transistor and methods for fabricating a device structure using a substrate. One or more primary trench isolation regions are formed that surround an active device region of the substrate and a collector contact region of the substrate. A base layer is formed on the active device region and the collector contact region, and the active device region includes a collector. Each primary trench isolation region extends vertically to a first depth into the substrate. A trench is formed laterally located between the base layer and the collector contact region and that extends vertically through the base layer and into the substrate to a second depth that is less than the first depth. A dielectric is formed in the trench to form a secondary trench isolation region. An emitter is formed on the base layer.

Compact device structures for a bipolar junction transistor

Disclosed are embodiments of a transistor, which incorporates an airgap for low base-emitter capacitance (C). Each embodiment of the transistor has a monocrystalline base and, within the monocrystalline base, an intrinsic base region and an extrinsic base region positioned laterally adjacent to the intrinsic base region, wherein the intrinsic and extrinsic base regions have co-planar top surfaces. An essentially T-shaped emitter in cross-section has a lower emitter region on the intrinsic base region and an upper emitter region above the lower emitter region. Each embodiment of the transistor further has an airgap, which is positioned laterally adjacent to the lower emitter region so as to be between the extrinsic base region and the upper emitter region. Thus, the entire airgap is above the co-planar top surfaces of the intrinsic base region and the extrinsic base region. Also disclosed herein are methods of forming the transistor embodiments.

Transistor with an airgap for reduced base-emitter capacitance and method of forming the transistor

Device structure and fabrication methods for a bipolar junction transistor. An emitter layer is formed on a base layer and etched to form an emitter of the device structure. The emitter layer has a concentration of an element that varies as a function of the thickness of the emitter layer. The etch rate of the emitter layer varies as a function of the concentration of the element such that the emitter has a variable width over the thickness of the emitter layer.

Shaped terminals for a bipolar junction transistor

The present disclosure relates to semiconductor structures and, more particularly, to transistors with improved channel mobility and methods of manufacture. A structure includes: a curved beam structure formed from at least one stressed material; a cavity below the curved beam structure; and at least one semiconductor device on a top portion or a bottom portion of the curved beam structure whose carrier mobility is increased or decreased by a curvature of the curved beam structure.

Transistor with improved channel mobility

The present disclosure generally relates to semiconductor structures and, more particularly, to heterojunction bipolar transistor device integration schemes on a same wafer and methods of manufacture. The structure includes: a power amplifier (PA) device comprising a base, a collector and an emitter on a wafer; and a low-noise amplifier (LNA) device comprising a base, a collector and an emitter on the wafer, with the emitter having a same crystalline structure as the base.

Heterojunction bipolar transistor device integration schemes on a same wafer

Device structures and fabrication methods for a bipolar junction transistor. The device structure includes an intrinsic base, an emitter having a vertical arrangement relative to the intrinsic base, and a collector having a lateral arrangement relative to the intrinsic base. The device structure may be fabricated by forming the intrinsic base and the collector in a semiconductor layer, and epitaxially growing the emitter on the intrinsic base and with a vertical arrangement relative to the intrinsic base. The collector and the intrinsic base have a lateral arrangement within the semiconductor layer.

Bipolar junction transistors with a combined vertical-lateral architecture

The present disclosure relates to semiconductor structures and, more particularly, to integrated CMOS wafers and methods of manufacture. The structure includes: a chip of a first technology type comprising a trench structure on a front side; a chip of a second technology type positioned within the trench structure and embedded therein with an interlevel dielectric material; and a common wiring layer on the front side connecting to both the chip of the first technology type and the chip of the second technology type.

Integrated CMOS wafers

The present disclosure relates to semiconductor structures and, more particularly, to a heterojunction bipolar transistor with a stress component and methods of manufacture. The heterojunction bipolar transistor includes a collector region, an emitter region and a base region. Stress material is formed within a trench of a substrate and surrounding at least the collector region and the base region.

Heterojunction bipolar transistor with stress component

Device structures and fabrication methods for a device structure. One or more trench isolation regions are formed in a substrate to surround a device region. A base layer is formed on the device region. First and second emitter fingers are formed on the base layer. A portion of the device region extending from the first emitter finger to the second emitter finger is free of dielectric material.

Growing community of inventors

Williston, VT, United States of America

Renata A Camillo-Castillo