Delta Electronics, Inc.

Ren-Chun Chang

Wei-Chih Lin

Wen-Yin Tsai

Li-Hsiu Chen

Yan-Hui Jian

Ming-Tang Yang

Yin-Yuan Chen

Chen-Yu Yu

Chiu-Chin Chang

Chia-Hsing Chen

Hsuan-Ting Liu

Chih-Hung Tsai

Wu-Hua Hsiao

Wei-Zhi Lin

Chun-Chieh Wang

Sheng-Chi Wu

Peng-Yuan Chen

Chia-Yi Lin

Shao-Hsuan Lai

Siang-Lin You

The present disclosure provides a cooling system, including an air-cooling device and a water-cooling device. The air-cooling device includes a first fan, an evaporator, a first condenser, and a second fan. The first fan is arranged in a first cooling room and configured to blow a hot air inside a rack into a first cooling room. The evaporator is arranged in the first cooling room. The first condenser is arranged in a second cooling room. The second fan is arranged in the second cooling room and configured to blow an outside air into the second cooling room. The water-cooling device includes a radiator. The radiator is arranged in the second cooling room and configured to receive a hot liquid from an electronic device in the rack through a third pipeline and transmit a cold liquid to the electronic device through a fourth pipeline.

Cooling system

A working fluid recovery device includes an air moving unit, a water removal unit, a working fluid recovery unit, a condenser, and a working fluid collection tank. The air moving unit is configured to suck in a mixed gas including a non-condensable gas, a steam and a vapor phase of working fluid. The water removal unit is connected to the air moving unit, and configured to remove the steam. The working fluid recovery unit is connected to the water removal unit, and configured to recover the vapor phase of the working fluid and exhaust the non-condensable gas. The condenser is connected to the working fluid recovery unit, and configured to condense the vapor phase of the working fluid into a liquid phase of the working fluid. The working fluid collection tank is connected to the condenser, and configured to store the liquid phase of the working fluid.

Two-phase immersion cooling system, working fluid recovery device and method

An immersion cooling system includes a cooling tank, a housing and a valve. The coolant tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The housing covers a side of the cooling tank and thereby forms an enclosure. The valve has two ports, one of which communicates with the enclosure and the other communicates with a part of the cooling tank above the liquid coolant. The valve is configured to open in response to a gas pressure inside the cooling tank exceeding an upper limit.

Immersion cooling system and immersion cooling method

An immersion cooling system includes a cooling tank and a filtration system. The cooling tank is configured to accommodate a liquid coolant and an electronic device immersed in the liquid coolant. The filtration system includes a pipeline, a pump, a filter and a cooling device. The pipeline is in fluid communication with the cooling tank. The pump is disposed in the pipeline and is configured to drive the liquid coolant to flow through the pipeline. The filter is disposed in the pipeline and is configured to filter the liquid coolant. The cooling device is connected to the pipeline and is configured to cool the liquid coolant. The pipeline has an inlet connected to the cooling tank. The cooling device is located between the pump and the inlet of the pipeline.

An immersion cooling system includes a tank, a first condenser, an enclosure, a second condenser and a connecting pipe. The tank has a first space. The first space is configured to accommodate a cooling liquid for at least one electronic equipment to immerse therein. The first condenser is disposed inside the tank. The enclosure is disposed outside the tank. The enclosure forms a second space together with the tank. The second condenser is disposed in the second space. The connecting pipe includes a first end and a second end opposite to the first end. The first end is connected with the second condenser. The second end is communicated with the first space.

Immersion cooling system

The present disclosure provides an immersion cooling system for a server cabinet including a plurality of server boxes, a cooling tank and a plurality of liquid connecting pipes. Each server box includes an electronic device immersed in the cooling liquid, and the electronic device generates a thermal energy so that part of the cooling liquid evaporates into a hot vapor. The cooling tank is connected to the plurality of server boxes and includes a condenser and a storage part. The condenser is connected to each server box and condenses the hot vapor to form the cooling liquid. The storage part storages the cooling liquid from the condenser. Two ends of the liquid connecting pipe is connected to the storage part and the server box respectively. The cooling liquid in the storage part and the cooling liquid of each server box are maintained in a same liquid level.

Immersion cooling system and cooling method thereof

An immersion cooling system includes a tank, an isolation plate and a condenser. The tank includes a base plate and a sidewall connected with the base plate. The sidewall defines with the base plate a space configured to accommodate a cooling liquid. The isolation plate connects with the sidewall or the base plate and divides the space into a first subsidiary space and a second subsidiary space. The first subsidiary space is configured to accommodate electronic equipment which is immersed in the cooling liquid. The isolation plate and the base plate are separated from each other. The sidewall surrounds the condenser. A vertical projection of the condenser towards the base plate at least partially overlaps with the second subsidiary space. The electronic equipment evaporates a portion of the cooling liquid to form a vapor. The condenser is configured to condense the vapor into a liquid form.

A cooling device applied in a projection apparatus and the projection apparatus are provided. The projection apparatus comprises a first light source, a second light source, a third light source and the cooling device. The cooling device comprises an airflow guiding device and a fan. The airflow guiding device is adapted to define a first flow path and a second flow path. The first flow path has a first position, while the second flow path has a second position and a third position, correspondingly disposed with the first light source, the second light source and the third light source, respectively. The fan is adapted to generate airflow. The airflow is divided into a first airflow and a second airflow entering the first flow path and the second flow path, respectively. Thereby, the cooling device is capable of matching the heat dissipation requirements of the light sources and reducing the noise generated by the cooling device by using only one fan.

Cooling device for a projection apparatus and said projection apparatus

A wind speed detecting circuit includes a heating unit, a first temperature sensor, a second temperature sensor, a control unit and a driving unit. The first temperature sensor detects a first temperature of an internal portion of an electronic device, thereby generating a first detecting signal. The second temperature sensor detects a second temperature of the heating unit, thereby generating a second detecting signal. The control unit generates a modulation signal according to the first detecting signal and the second detecting signal. In response to the modulation signal, the driving unit generates a driving signal to control operations of the heating unit, so that a temperature difference between the first temperature and the second temperature is maintained constant. A specified relation between the wind speed and the modulation signal facilitates discriminating whether a dust-proof element of the electronic device needs to be replaced.

Wind speed detecting circuit capable of detecting the timing for replacing dust-proof element of electronic device

An electronic device having a heat-dissipating structure for a socket is disclosed. The electronic device comprises a case, a plurality of electronic components disposed in the case, an airflow inlet disposed at a first side of the case, a socket disposed at a second side of the case, wherein the second side is opposite to the first side and the electronic components are disposed between the first side and the second side, and an airflow directing plate disposed between the case and the electronic components and forming an airflow channel with the case for directing a portion of air at the airflow inlet to the socket through the airflow channel so as to dissipate heat of the socket. Through the design of the present invention, the heat of the socket of the electronic device can be dissipated efficiently to conform to the safety standard of the socket temperature.

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Taoyuan Hsien, Taiwan

Ren-Chun Chang