Alpha Assembly Solutions Inc.

Remya Chandran

Bawa Singh

Siuli Sarkar

Ranjit Pandher

Sutapa Mukherjee

Pavan Vishwanath

Nitin Vithalbhai Desai

Oscar Khaselev

Sathish Kumar

Rahul Raut

Monnir Boureghda

Anna Lifton

Ravi Bhatkal

Nirmalya Kumar Chaki

Shamik Ghoshal

Shamik Ghosal

Ashok Pachamuthu

Morgana De Avila Ribas

Ravindra Mohan Bhatkal

Morgana Ribas

V Sathish Kumar

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Sintering materials and attachment methods using same

A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.

Sintering paste

A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise: a core comprising a first material; and a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.

Multilayered metal nano and micron particles

Sintering powder

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Bengaluru, India

Remya Chandran