Amkor Technology, Inc.

Remigio V Burro, Jr

Sean Timothy Crowley

Blake A Gillett

Philip S Mauri

Ferdinand E Belmonte

Victor M Aquino, Jr

Bradley D Boland

A semiconductor device is disclosed that includes a semiconductor die, a metal leadframe, and a metal strap. A bottom surface of the semiconductor device is on and electrically coupled to a first portion of the leadframe. A first end portion of the metal strap is on and electrically coupled to a top surface of the semiconductor die. An opposite, second end portion of the metal strap is on and electrically coupled to a second portion of the leadframe within a recess of the second portion of the leadframe.

Semiconductor device including metal strap electrically coupled between semiconductor die and metal leadframe

Attaching semiconductor dies to substrates with conductive straps

Growing community of inventors

San Pedro, Philippines

Remigio V Burro, Jr