Vermon

Other

Vermon S.a.

Institut National De La Sante Et De La Recherche Medicale

Université Pierre Et Marie Curie

Carthera S.a.s.

Rémi Dufait

An Nguyen-Dinh

Aimé Flesch

Philippe Auclair

Christophe Notard

Jean-Yves Chapelon

Alexandre Carpentier

Cyril Lafon

Michael Canney

Françoise Chavrier

Pascal Mauchamp

Nicolas Felix

William Apoutou N'Djin

Dominique Dinet

Leong Ratsimandresy

Elisabeth Lacaze

William Apoutou N'djin

An interstitial ultrasound thermal ablation applicator for conformal treatment of an inhomogeneous tumor lesion includes: a body having a longitudinal axis; and a plurality of array transducers mounted on the body, arranged side by side and having azimuth directions parallel to the longitudinal axis of the body, and having outer faces disposed in a polygonal arrangement; the plurality of array transducers having predetermined elevation dimensions defined for directing emitted ultrasonic energy to obtain a conformal volume treatment of the tumor lesions. An electronic driving method for driving an applicator having multiple independent transducer elements arranged in rows and columns includes: controlling focal parameters of each row and column of transducer elements; and controlling a contribution of each row and column of transducer elements in a manner to provide a conformal ablated volume.

Interstitial ultrasonic disposable applicator and method for tissue thermal conformal volume ablation and monitoring the same

A capacitive micro-machined ultrasonic transducer (CMUT) array includes an improved elementary aperture for imaging operations. The transducer can be of a linear, curved linear, annular, matrix or even single surface configuration. The elementary apertures thereof are formed by a specific arrangement of capacitive micromachined membranes (CMM) so as to exhibit ideal acoustical and electrical behavior when operated with imaging systems. The CMM arrangements can be either conventional where the element transducers of the array are uniformly shaped by predefined CMMs in a manner such as to exhibit acoustic behavior similar to a piezoelectric transducer, or can be more sophisticated, wherein each element transducer is formed by a specific combination of different CMMs (i.e., of a different size and/or shape) so as to provide the transducer with built-in acoustic apodization that can be implemented in the azimuth and/or elevation dimension of the device.

Capacitive micro-machined ultrasonic transducer for element transducer apertures

An ultrasonic imaging probe is provided which is capable of capturing 'on-the-fly' scanning planes in successive positions of the probe so as to form a volumetric image representation at a real time frame rate. The probe includes a flexible sealing membrane for a coupling fluid. Laterally extending folding portions of the flexible membrane provide fluid isolation and cancellation of parasitic constraining forces normally generated during probe movement.

Ultrasonic probe for scanning a volume

A method is provided for manufacturing crossing/intersecting transducer arrays including first and second ultrasonic transducer arrays which intersect centrally of one another. Each transducer operates independently without any decrease in acoustic performance. The first and second arrays have their own independent signal electrodes, respectively disposed on the front and rear surfaces of the device. Because the arrays are built on a unique piezoelectric member, a portion of signal electrode of each array is adapted to be connected to ground in a manner permitting proper operation of the entire array. A method of forming matching layer sets incorporating electrical interconnections is also provided.

Intersecting ultrasonic transducer arrays

A method is provided for producing a matrix array ultrasonic transducer having an integrated interconnection assembly. A piezoelectric member, formed by a plurality of individual elemental transducers arranged in M&#xd7;N matrix configuration, is provided and an interconnect interface device is joined to the rear face of the piezoelectric member. A plurality of printed circuits are then attached to the interconnect device so as to enable the resultant transducer array to be electrically connected to an external cable. The interconnect device is formed by an insulator member having dimensions in accordance with those of the piezoelectric member. A drilling operation is performed on the insulator member to form a corresponding array of through holes. The insulator member is then metallized and a resin used to provide filling of the through holes. Grooves are formed in at least one face of the insulator for receiving the printed circuits.

Method for providing a matrix array ultrasonic transducer with an integrated interconnection means

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Tours, France

Rémi Dufait