Stmicroelectronics (grenoble 2) Sas

Stmicroelectronics S.a.

Stmicroelectronics S.r.l.

Remi Brechignac

Romain Coffy

Jean-Michel Riviere

Juan Exposito

Jerome Lopez

Julien Vittu

Olivier Zanellato

Pierangelo Magni

Kum Weng Loo

Chek Lim Kho

Jean-Manuel Bernardo

Carlo Cognetti De Martiis

The present description concerns a package for an electronic device. The package including a plate and a lateral wall, separated by a layer made of a bonding material and at least one region made of a material configured to form in the region an opening between the inside and the outside of the package when the package is heated.

Electronic package

An electronic device includes a first electronic component and a second electronic. Each electronic component includes a carrier substrate having a back side and a front side, an electronic chip including an integrated optical element, an overmolded transparent block encapsulating the electronic chip above the carrier substrate, and electrical connections between the electronic chip and electrical contacts of the carrier substrate. An overmolded grid encapsulates and holds the first and second electronic components. The grid is configured so that sides of the first and second electronic components are at least partially exposed.

Electronic device comprising optical electronic components and fabricating process

An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.

Optoelectronic device

An opaque dielectric carrier and confinement substrate is formed by a stack of layers laminated on each other. The stack includes a solid back layer and a front frame having a peripheral wall and an intermediate partition which delimits two cavities located on top of the solid back layer and on either side of the intermediate partition. Electronic integrated circuit (IC) chips are located inside the cavities and mounted on top of the solid back layer. Each IC chip includes an integrated optical element. Electrical connections are provided between the IC chips and back electrical contacts of the solid back layer. Transparent encapsulation blocks are molded in the cavities to embed the IC chips.

Electronic device comprising optical electronic components and manufacturing method

An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated within a first encapsulation layer, and the receiver is encapsulated within a second encapsulation layer. An opaque layer covers the first encapsulation layer (encapsulating the receiver) and covers the second encapsulation layer (encapsulating the emitter). The first and second encapsulation layers are separated by a region of opaque material. This opaque material may be provided by the opaque layer or an opaque fill.

An electronic package includes a substrate wafer having front and rear faces. An emitting integrated circuit chip is mounted to the front face of the substrate wafer and includes a light radiation optical emitter. A receiving integrated circuit chip is also mounted to the front face of the substrate wafer and includes at least one light radiation optical sensor. A transparent encapsulant extends above the optical sensor and the optical emitter. An opaque encapsulant encapsulates the transparent encapsulant. The opaque encapsulant has a front window situated above the optical emitter and which is offset laterally relative to the optical sensor. The transparent encapsulant accordingly has an uncovered front face situated above the optical emitter and offset laterally relative to the optical sensor. The opaque encapsulant may include an additional front window. The receiving integrated circuit chip further includes a second optical sensor situated opposite the additional front window.

Optical electronic package having a blind cavity for covering an optical sensor

A semiconductor device includes at least one first component () (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer () is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer () is formed on the front face of the first component and on the first face of the support layer. An electrical connection network () within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component () (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network. Electrical connection vias () pass through the support layer and selectively connect the electrical connection network to an external electrical connection formed on a second face of the support layer.

Semiconductor device having stacked components

An optical semiconductor module including an optical semiconductor component that has a front face including an optical sensor. Encapsulation, defining a cavity in which the optical component is disposed, includes external electrical connections for the optical semiconductor component, and includes a window allowing light to pass through it toward the optical sensor. An optical lens () is disposed in the cavity () between the optical sensor () and the window (). A support structure () supports the optical lens. This optical semiconductor module may also include a shield ().

Optical semiconductor package with incorporated lens and shielding

A method is described for fixing a lens of an optical group with respect to an optical sensor in an image acquisition device comprising the steps of housing the optical sensor in a housing, fixing a lower holder of the optical group to the housing, aligning an upper holder of the optical group, wherein the lens is placed, with the sensor so as to align a focusing point of the lens with respect to the sensor, welding the upper holder to the lower holder. The welding step may be performed by means of ultrasounds.

Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device

Optical semiconductor package and its fabrication process, in which: a rear face of a first semiconductor component () such as a microprocessor is supported by a front face of an electrical connection support plate (); a rear face of a second semiconductor component () is fixed to a front face of the said first component () and a front face of this second component has an optical sensor (); first electrical connection means () connect the said first component to the front face of the said support plate; second electrical connection means () connect the said second component to the front face of the said support plate; means () ensure encapsulation of the said components stacked on the said support plate and of the said electrical connection means, the said encapsulation means being made from a transparent material which is opposite the said optical sensor; and external electrical connection means () are located on an exposed part of the said support plate.

Optical semiconductor housing and method for making same

A process is provided for fabricating an optical semiconductor package. According to the process, a first semiconductor component is fixed to a rear face of an electrical connection support plate, and this first component is electrically connected to the support plate. An encapsulation block for the first component is molded on the rear face of the support plate. A second semiconductor component, a front face of which has an optical sensor, is fixed to one face of the first component, and this second component is electrically connected to the support plate. The second component is encapsulated on the front face of the support plate. Also provided is an optical semiconductor package.

Optical semiconductor package and process for fabricating the same

An optical semiconductor package includes an optical semiconductor component (), a front face of which has an optical sensor (), and encapsulation defining a cavity in which the optical component is placed and having external electrical connection () of this optical semiconductor component (). The encapsulation () includes a glass pane letting light through to the optical sensor. The encapsulation () includes electromagnetic screening () made of an electrically conductive material, that is externally connectable, this screening being electrically isolated in the optical semiconductor package from the electrical connection of the optical semiconductor component ().

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Grenoble, France

Remi Brechignac