Siced Electronics Development Gmbh & Co Kg

Sciced Electronics Development Gmbh & Co. Kg

Reinhold Sch&ouml;rner

Dethard Peters

Peter Friedrichs

Dietrich Stephani

Heinz Mitlehner

Wolfgang Bartsch

A semiconductor configuration with an ohmic contact-connection includes a p-conducting semiconductor region made of silicon carbide. A p-type contact region serves for the contact-connection. The p-type contact region is composed of a material containing at least nickel and aluminum. A substantially uniform material composition is present in the entire p-type contact region. A method for contact-connecting p-conducting silicon carbide with a material containing at least nickel and aluminum is also provided. The two components nickel and aluminum are applied simultaneously on the p-conducting semiconductor region.

Method for contacting a semiconductor configuration

A semiconductor configuration for current control has an n-type first semiconductor region with a first surface, a p-type covered island region, within the first semiconductor region, with a second surface, an n-type contact region arranged on the second surface within the island region and a lateral channel region, formed between the first and second surface as part of the first semiconductor region. The channel is part of a current path from or to the contact region. The current within the lateral channel region may be influenced by at least one depletion zone. A lateral edge of the lateral channel region extends as far as the contact region.

Semiconductor construction with buried island region and contact region

A semiconductor configuration with ohmic contact-connection includes a first and a second semiconductor region made of silicon carbide, each having a different conduction type. A first and a second contact region serve for contact-connection. The first contact region and the second contact region have an at least approximately identical material composition which is practically homogeneous within the respective contact region. A method is provided for contact-connecting n-conducting and p-conducting silicon carbide, in each case with at least approximately identical material.

Semiconductor configuration with ohmic contact-connection and method for contact-connecting a semiconductor configuration

The disclosed semiconductor device comprises an ohmic contact between a semiconductor region made of n-conducting silicon carbide and a largely homogeneous ohmic contact layer ( ), which adjoins the semiconductor region and is made of a material having a first and a second material component. A silicide formed from the first material component and the silicon of the silicon carbide and a carbide formed from the second material component and the carbon of the silicon carbide are contained in a junction region between the semiconductor region and the ohmic contact layer. The silicide and carbide formation take place at maximum 1000&deg; C.

Semiconductor device with ohmic contact-connection and method for the ohmic contact-connection of a semiconductor device

A semiconductor structure includes at least one &agr;-silicon carbide region and an electrically insulating region, e.g. made of an oxide layer, and an interface located between them. The selection of an &agr;-silicon carbide polytype having a smaller energy gap than that of the 6H silicon carbide polytype for at least one region near the interface results in a high charge carrier mobility in this region.

Semiconductor structure having a predetermined alpha-silicon carbide region, and use of this semiconductor structure

The SiC semiconductor structure contains at least three semiconductor regions. The surface area of the third semiconductor region encompasses that of the second semiconductor region as a second partial area, which in turn encloses the surface of the first semiconductor region as a first partial area. The contour of the edge of the second partial area is determined by the contour of the edge of the first partial area to the effect that the second partial area can be represented essentially as a specially enlarged mapping of the first partial area, the deviation of the contour of the edge of the second partial area from the exact contour that results in the course of the mapping being at most &plusmn;10 nm.

Semiconductor structure based on silicon carbide material, with a plurality electrically different partial regions

A thin-film system is deposited onto a surface of a semiconductor region. After at least one window has been opened in the thin-film system, the window serves as a mask for a first selective processing of a first semiconductor partial region. By undercutting the thin-film system, the edge of the window is drawn back approximately uniformly by a mean undercutting depth. The at least one enlarged window serves as a mask for a second selective processing of a second semiconductor partial region. A semiconductor structure is also provided.

Growing community of inventors

Grossenseebach, Germany

Reinhold Schörner

Growing community of inventors

Grossenseebach, Germany

Reinhold Sch&ouml;rner

Reinhold Schörner