Infineon Technologies Ag

Reinhold Gaertner

Harald Gossner

Wolfgang Stadler

A semiconductor sensor device is electrically coupled to an object. An attachment member attaches the semiconductor sensor device to the object. The attachment member comprises a first conductive contact region and a second conductive contact region. An insulating portion is electrically isolates the semiconductor sensor device from the first conductive contact region and second conductive contact region.

Attachment member for semiconductor sensor device

A method of conducting an electrostatic discharge test on an integrated circuit is described. The method comprises configuring a test board assembly to emulate characteristics of a system in which the integrated circuit is to be used, coupling the integrated circuit to the test board assembly, and applying an electrostatic discharge test signal of system-level type to the test board assembly.

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Starnberg, Germany

Reinhold Gaertner