Siemens Aktiengesellschaft

Siemens Solar Gmbh

Siemens Solar Industries International

Reinhart Schade

Egon Edinger

Adolf Muenzer

Friedrich-Wilhelm Schulze

Gerhard Lehner

Robert Wieting

Arthur G Pauli

Karl Stiel

A solar cell has electrical conductors applied on a pattern of electric contacts on a front surface and extending transversely relative thereto with a portion projecting beyond the edge of the solar cell. The formation of the electrical pattern includes at least two elongated portions interconnected by a return portion which extends beyond the one edge. This return portion provides a stiffening suitable for reliable interconnection to an additional solar cell to achieve a connection of two conductors in the projecting region.

Solar cell with a connecting structure

A transducer plate comprises electrically-conductive material on both sides and carries a respective piezoceramic on each side which has a respective electrode. The piezoceramics are electrically connected in parallel and are connected to the transducer plate via a respective, insulating adhesive layer. For the purpose of contacting the two inner electrodes, a passage is provided in the transducer plate and a connector ribbon is located between the adhesive layer and the inner electrode of one side and extends through the passage 2 to a position between the inner electrode and the adhesive layer of the other side. Only a single connector ribbon is therefore required for the pressure contacting of the two inner electrodes. Apparatus for threading the connector ribbon through the passage comprises bed dies having guide channels for the connector ribbon, whereby the connector ribbon is threaded through the passage either by way of a hob extruding die or by way of a curved-shaped surface of a guide channel.

Transducer plate for piezoelectric transducers

Electrical contact is made on the adhesive-side electrode of an electrical component which is connected to an electrically conductive carrying plate, with the aid of an insulating adhesive which not only ensures good contact is made, but is also suitable for automation. At one or more points the adhesive layer applied on the carrier plate before a bonding operation is pressed away by contact-forming projections during the joining and bonding operation which takes place under the influence of heat and pressure. Embossed projections on the adhesive-coated carrier plate can be used as the structure by which contact is made.

Method for making contact with the electrode on the adhesive-coated side

A liquid crystal cell having a pair of carrier plates, which are spaced apart from one another by a frame with each of the plates on an inner surface containing electrically conductive coatings, characterized by the electrical conductive coatings on one of the two carrier plates forming an electrode and being connected to a terminal electrode arranged on the inner surface of the other character plate by a conductor bridge, which is located on the outside of the frame and comprises a metallization which serves to contact the two end surfaces of the two electrodes which end surfaces extend to the plane of the edges of their respective carrier plate. The process for forming the liquid crystal cell includes forming a plurality of the carrier plates on a single member and subsequently subdividing the single member into the individual carrier plates with the step of subdividing ensuring that the edge of the electrodes lies in the plane of the edge of the carrier plate. In addition, the process includes providing an insulating layer with the edge of the electrodes being masked and also portions adjacent the edge of the electrodes being masked from the material forming the insulating layer.

Liquid crystal cell having electrodes on adjacent plates connected by a

An electric component comprising at least two flat elements is produced by coating a side of one of the elements, a metal sheet, with a co-polymer layer or by taking a sheet having a co-polymer layer thereon, and punching first elements therefrom. The co-polymer layer is softened by heating and the second element is pressed controllably onto the first and into the co-polymer layer. The layer does not run and so maintains an insulating separation between the elements, while bonding the elements firmly together. Piezoceramic resonators and semi-conductors circuits are advantageously joined to punch-formed parts in this manner.

Growing community of inventors

Olching, Germany

Reinhart Schade