Ciba-geigy Corporation

Ciba Specialty Chemicals Corporation

Ocg Microelectronic Materials, Inc.

Ocg Microelectronics, Inc.

Reinhard Schulz

Ekkehard Bartmann

Norbert Munzel

Horst Munzel

Martin Roth

Stephan Ilg

Wilhelm Knobloch

Heinz Holzwarth

Jean-Pierre Wolf

Jean-Luc Birbaum

Hitoshi Yamato

Toshikage Asakura

Hartmut Hartner

Rudolf Klug

Norbert M Unzel

Jorg Sassmannshausen

Iodonium salts as latent acid donors

The invention relates to the use of oxime sulfonates of formula 1 ##STR1## wherein R is naphthyl, ##STR2## Ar is an unsubstituted aryl group or an aryl group which carries one or more than one substituent selected from the group consisting of nitro, chloro, bromo, hydroxyl, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 perfluoroalkyl, C.sub.1 -C.sub.4 alkoxy and acid degradable substituent;

High resolution i-line photoresist of high sensitivity

The invention relates to the use of oxime sulfonates of formula 1 ##STR1## wherein R is naphthyl, ##STR2## Ar is an unsubstituted aryl group or an aryl group which carries one or more than one substituent selected from the group consisting of nitro, chloro, bromo, hydroxyl, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 perfluoroalkyl, C.sub.1 -C.sub.4 alkoxy and acid degradable substituents;

Positive photoresist compositions comprising, in an organic solvent, at least

Tetra (hydroxphenyl) alkanes

Positive photoresists with enhanced resolution and reduced

Positive photoresists containing quinone diazide photosensitizer,

Structures of high resolution in the near UV range and of high sharpness of edge and steepness of edge can be obtained by means of positive photoresists containing, in an organic solvent, in each case essentially at least

Positive photoresist containing 1,2-naphthoquinone-diazide-5-sulfonyl

Positive-working photoresist compositions containing 23-27%, based on said composition, of at least one compound of formula (I) ##STR1## wherein one of the substituents X is hydrogen or a group of formula II ##STR2## and the other substituents X are a group of formula II; and 6-11%, based on said composition, of at least one polyhydroxy compound of formula III ##STR3## wherein X is a direct bond, --O--, --S--, --SO.sub.2 --, --CO-- or C(R.sub.6 (R.sub.7)--, and R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 are each independently of the other hydrogen, halogen, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy or hydroxy, and R.sub.6 and R.sub.7 are each independently of the other hydrogen, --CH.sub.3 or --CF.sub.3. These compositions have particularly good profile contrast and exhibit insignificant fluctuations in line width.

Photoresist composition containing specific amounts of a naphthoquinone

The invention relates to positive photoresists based on alkali-soluble phenolic resin and photosensitive quinonediazide compounds which, by means of particular additives, give relief structures produced therewith an increased stability towards changes due to thermal effects.

Positive photoresist composition containing alkali-soluble phenolic

The invention relates to positive working photoresists for producing relief structures of high-temperature resistant polyimide prepolymers, which photoresists can be developed in aqueous-alkaline medium and which contain, in an organic solvent, essentially at least

Positive photoresist composition containing radiation sensitive

Positive photoresist containing 2,3,4-trihydroxybenzophenone and

The invention relates to negative photoresists of the polyimide type essentially containing, in an organic solvent, in each case at least

Growing community of inventors

Staufen-Wettelbrunn, Germany

Reinhard Schulz