Corning Incorporated

Reinhard Moritz Malchus

Garrett Andrew Piech

Sasha Marjanovic

Ralf Joachim Terbrueggen

Tobias Christian Roeder

Vytautas Sabonis

Valdemaras Juzumas

Methods, systems, devices, and substrates are described. In some examples, an apparatus may include optical components configured to adjust an input to a laser cutting optic for modifying a substrate (e.g., an optically transmissive substrate). In some examples, the optical components may include a beam deflector, a first optic configured to output a first laser beam with a first beam width, and a second optic configured to output a second laser beam with a second beam width. In some examples, the beam deflector may modify an optical path of a pulsed laser (e.g., through the first optic or through the second optic), which may result in an input to the laser cutting optic having a beam width corresponding to the first optic or the second optic. The different input beam widths may modify a line focus intensity of an output of the laser cutting optic when modifying the substrate.

Real-time modification of line focus intensity distribution

A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tof 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength λ, a spot size w, and a Rayleigh range Zthat is greater than where Fis a dimensionless divergence factor comprising a value of 10 or greater.

Methods for laser processing transparent workpieces using modified pulse burst profiles

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Munich, Germany

Reinhard Moritz Malchus