Conti Temic Microelectronic Gmbh

Semikron Elektronik Gmbh &co.kg

Reinhard Helldörfer

Ingo Bogen

Günter Anton Fendt

Guido Wetzel

Hartmut Kulas

Lothar Weichenberger

Markus Beck

Alexander Popescu

A power semiconductor device comprising a power semiconductor module and a heat sink and a method for its manufacture. The heat sink has a first cooling housing component, with a cutout passing therethrough, and a second cooling housing component, with a cooling plate arranged in the cutout. The first and second cooling housing components are configured and arranged relative to one another so that a cavity is formed at the side of the cooling plate facing away from the power semiconductor components. The cooling plate is connected to the first cooling housing component by a first weld seam which extends circumferentially therearound. The first weld seam seals the cooling plate in relation to the first cooling housing component, and the second cooling housing component is connected to the first cooling housing component. The inventive power semiconductor device has good heat conduction from the power semiconductor components to a heat sink.

Power semiconductor device and method for producing a power semiconductor device

Disclosed is a device for activating a security system in a vehicle including a first and second vehicle sensor (). The sensor include, respectively, a measuring value sensor () which can detect acceleration and structure-borne noise, and a central unit () which evaluates the signals of at least two vehicle sensors () and activates the security system according to the signals. The first and second vehicle sensors have a first direction of sensitivity for at least one measuring value sensor (), which is used to detect acceleration, and a second direction of sensitivity for at least one measuring value sensor () which is used to detect structure-borne noise.

Device for activating a security system in a vehicle

Growing community of inventors

Baiersdorf, Germany

Reinhard Helldörfer