Infineon Technologies Ag

Reinhard Fischbach

Manfred Fries

Heinz Opolka

Paul-Werner Von Basse

Detlef Houdeau

Domagoj Siprak

Christian Peters

Thomas Scheiter

Michael Melzl

Werner Kröninger

Manfred Frank

Thomas M&uuml;nch

Thomas Münch

Thorsten Sasse

Andreas Gaymann

Thomas Rosteck

Reinhard G&ouml;llner

Klaus Hammer

Markus Witte

Justin Bierner

Renate Köpnick

Richard Hummel

Manfred Zaeske

Rainer Grossmann

To increase the scratch resistance of a surface passivation, in particular, for fingerprint sensors, a antifrictional layer is applied to reduce the shearing forces. The antifrictional layer includes fat, oil, surfactants and/or wax. The antifrictional layer is preferably an emulsion including water, paraffin oil, propylene glycol, stearic acid, palmitic acid, TEA, beeswax, carbormer 954, methylparaben, propylparaben and possibly perfume.

Scratch-resistant coating for a semiconductor component

In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Method of producing a biometric sensor

A housing for biometric sensor chips and a method for producing such a housing includes a freely accessible fingerprint checking area on a sensor chip, a mount substrate with contact outer surfaces thereon, the mount substrate being a mounting strip with perforated edges, on which the contact outer surfaces are disposed partially outside a housing frame, and the sensor chip is positioned within the housing frame.

Housing for biometric sensor chips and method for producing the housing

An electronic component is described and has a dielectric layer which is constructed on a substrate, conductive surfaces that are constructed on the dielectric layer, and an electrically conductive guard structure. The guard structure is disposed in a plane above the conductive surfaces such that the conductive surfaces are not completely covered by the guard structure.

Electronic component and utilization of a guard structure contained therein

A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.

Housing assembly for an electronic device and method of packaging an electronic device

Biometric sensor and method for its production

The sensor device is provided for sensing biometric characteristics, in particular finger minutiae, with a biometric sensor chip. The sensor chip is fastened on a flexible printed circuit board that has a highly flexible substrate layer and conductor tracks applied to the substrate layer. The conductor tracks are in electrical contact with the sensor chip and are led to a terminal region of the flexible printed circuit board. The sensing area of the sensor chip is accessible through an opening in the flexible circuit board and the opening is at least partially surrounded by a grounding frame.

Sensor device for sensing biometric characteristics, in particular finger minutiae

Growing community of inventors

Wuppertal, Germany

Reinhard Fischbach