Epcos Ag

Nokia Corporation

Reiner Welzer

Edgar Schmidhammer

Pasi Tikka

Habbo Heinze

Juha Ellä

Ansgar Schäufele

Jürgen Kiwitt

Herbert Zidek

Juha EllÄ

Ansgar Schaufele

An arrangement includes a substrate, a filter, a first bulk acoustic wave resonator, a second bulk acoustic wave resonator, and a large surface covering. The first bulk acoustic wave resonator includes a first electrode and a second electrode and is arranged flatly on the substrate. The second bulk acoustic wave resonator includes a first electrode and a second electrode and is arranged flatly on the substrate. The large-surface covering includes a metal layer over the substrate. The metal layer is connected to a ground terminal.

Filter assembly comprising two bulk wave resonators

A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.

Encapsulated electronics device with improved heat dissipation

Growing community of inventors

Munich, Germany

Reiner Welzer