Leybold Aktiengesellschaft

Applied Materials, Inc.

Balzers Aktiengesellschaft

Reiner Hinterschuster

Roland Gesche

Hans Georg Wolf

Berthold Ocker

Oliver Heimel

Mark Saunders

Lothar Lippert

Guenter Kemmerer

Andre Brüning

A chamber for physical vapor deposition is provided. The chamber includes a housing, a door for opening and closing the housing, and a bearing for receiving a target, wherein the bearing is oriented in a first direction. Further, the chamber is adapted so that the target is at least partially removable from the chamber in the first direction. According to an embodiment, a chamber for physical vapor deposition is provided. The chamber is adapted for receiving at least one target and a substrate. The chamber includes a housing, a door, and at least one bearing for mounting the target, wherein the bearing is attached to the door.

Chamber for physical vapour deposition and door for a physical vapour deposition chamber

A device for transporting substrates through a vacuum system has a flat, parallel piped, plate-shaped substrate holder with upper and lower holder areas that are moveable in a vertical position along a transport path through the system. The upper part of the substrate holder is supported without contact and is movably guided by a magnetic arrangement.

Transport device for workpieces in a vacuum system

An evacuable chamber serving as a cathode contains a rotatable magnet system and is connected to a high frequency power supply for sputtering a target. The chamber is electrically isolated from an evacuable housing containing the substrate to be coated, the chamber being covered by a cup-like shield fixed to the housing to define an interior space. A pipe for evacuating the chamber includes first and second sections separated by a gap and connected by an electrically insulating collar in which parallel metal grids are installed in the gap and respectively connected to the power source and to ground in order to prevent the formation of secondary plasma.

Cathodic sputtering system

Individual target segments (A-F), are mounted on a mounting plate by means of locating studs inserted into mounting holes of elongate or circular cross sections in correspondence with the change in length caused by the thermal expansion of the target segments. The segments are retained by screws received in tapped bones in the studs, which are welded to the target backplates. The individual segments (A-F) each consist of a target backplate and a target bonded to the backplate. The perimeter of each backplate over laps the perimeter of each target segment, this overlap amounting to 0.05-0.2 mm when molybdenum or titanium is used for the target backplate and an indium-tin alloy is used for the sputter target.

Large area sputter cathode having floating target segments

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Hammersbach, Germany

Reiner Hinterschuster