Asml Netherlands B.v.

Reinder Teun Plug

Arie Jeffrey Den Boef

Johannes Onvlee

Karel Diederick Van Der Mast

Franciscus Van De Mast

Hubert Marie Segers

Johan Christiaan Gerard Hoefnagels

Suzan Leonie Auer-Jongepier

Arno Jan Bleeker

Kaustuve Bhattacharyya

Hendrik Jan Hidde Smilde

Henricus Petrus Maria Pellemans

Armand Eugene Albert Koolen

Mircea Dusa

James Norman Wiley

Willem Marie Julia Marcel Coene

Anton Bernhard Van Oosten

Petrus Rutgerus Bartray

Sander Kerssemakers

Paul Jacques Van Wijnen

Martinus Joseph Kok

Wilhelmus Maria Corbeij

Martinus Gerardus Maria Johannes Maassen

Vidya Vaenkatesan

Bernardus A J Luttikhuis

David Christopher Christopher Ockwell

Harry H H M Cox

A method for inspection of a patterning device. The method includes obtaining (i) patterning device apparatus data of a patterning device making process, (ii) a patterning device substrate map based on the patterning device apparatus data, and (iii) predicted process window limiting pattern locations corresponding to the patterning device based on the patterning device substrate map, and based on the process window limiting pattern locations, guiding a patterning device inspection apparatus to the process window limiting pattern locations for defect inspection.

Guided patterning device inspection

A metrology system can be integrated within a lithographic apparatus to provide integrated metrology within the lithographic process. However, this integration can result in a throughput or productivity impact of the whole lithographic apparatus which can be difficult to predict. It is therefore proposed to acquire throughput information associated with a throughput of a plurality of substrates within a lithographic apparatus, the throughput information including a throughput parameter, and predict, using a throughput simulator, a throughput using the throughput parameter as an input parameter. The throughput simulator may be calibrated using the acquired throughput information. The impact of at least one change of a throughput parameter on the throughput of the lithographic apparatus may be predicted using the throughput simulator.

Method and apparatus for predicting performance of a metrology system

Systems and methods for processing wafers, a combined post expose bake and chill unit, and an interface are disclosed. An exemplary system includes a lithography tool, local track, transfer device, transfer device handler, interface unit, and controller to schedule processing. An exemplary combined post expose bake and chill unit includes an enclosure having an opening in its side, and a bake unit and a chill unit in the enclosure. An exemplary interface includes a plurality of enclosures arranged around robot(s) that transfer wafers among the enclosures, one of the plurality of enclosures being an integrated bake and chill unit.

Integrated post-exposure bake track

A metrology apparatus is arranged to illuminate a plurality of targets with an off-axis illumination mode. Images of the targets are obtained using only one first order diffracted beam. Where the target is a composite grating, overlay measurements can be obtained from the intensities of the images of the different gratings. Overlay measurements can be corrected for errors caused by variations in the position of the gratings in an image field.

Metrology method and apparatus, lithographic apparatus, device manufacturing method and substrate

A metrology tool is arranged to measure a parameter of a substrate that has been provided with a pattern in a lithographic apparatus. The metrology tool includes a base frame, a substrate table, a sensor, a displacement system, a balance mass, and a bearing. The substrate table is constructed and arranged to hold the substrate. The sensor is constructed and arranged to measure a parameter of the substrate. The displacement system is configured to displace the substrate table or the sensor with respect to the other in a first direction. The bearing is configured to movably support the first balance mass so as to be substantially free to translate in a direction opposite of the first direction in order to counteract a displacement of the substrate table or sensor in the first direction.

Metrology tool, system comprising a lithographic apparatus and a metrology tool, and a method for determining a parameter of a substrate

A lithographic apparatus configured to transfer a pattern from a patterning device onto a substrate includes an integrated post-exposure bake device, the post-exposure bake device configured to subject the substrate to a predefined temperature cycle. A post-exposure bake step of the substrate (a temperature cycle) is executed within a predetermined time period after the transfer of the pattern. The lithographic apparatus may be combined with a processing system having one or more processing modules. More efficient use may be made of the combination, allowing flexibility for a device manufacturing method.

Lithographic apparatus, combination of lithographic apparatus and processing module, and device manufacturing method

To inspect all portions of the substrate the substrate table can be moved rotationally and linearly. Furthermore the detector can be moved rotationally. This enables all portions of a surface of the substrate to be inspected from all angles in a plane parallel to the substrate. Less linear motion is needed, so the apparatus occupies a smaller volume and generates smaller vibrations.

Apparatus for angular-resolved spectroscopic lithography characterization and device manufacturing method

A metrology tool is arranged to measure a parameter of a substrate that has been provided with a pattern in a lithographic apparatus. The metrology tool includes a base frame, a substrate table constructed and arranged to hold the substrate, a sensor constructed and arranged to measure a parameter of the substrate, a displacement system configured to displace the substrate table or the sensor with respect to the other in a first direction, a balance mass, and a bearing configured to movably support the first balance mass so as to be substantially free to translate in a direction opposite of the first direction in order to counteract a displacement of the substrate table or sensor in the first direction.

A lithography system in which a performance criterion of the lithography system is predicted, based on one or more operating conditions of the lithography system, and compared to measurements of that performance criterion. The lithography system may determine from a difference between the measured and predicted performance criterion which, if any, sub-system of the lithography system is not performing as expected.

Lithography system, control system and device manufacturing method

A metrology tool is arranged to measure a parameter of a substrate that has been provided with a pattern in a lithographic apparatus. The metrology tool includes a base frame, a substrate table constructed and arranged to hold the substrate, at least one sensor constructed and arranged to measure a parameter of the substrate, a displacement system to displace one of the substrate table and sensor with respect to the other one of the substrate table and sensor in at least a first direction, a first balance mass, and a first bearing which movably supports the first balance mass so as to be substantially free to translate in the opposite direction of the first direction in order to counteract a displacement of the one of the substrate table and sensor in the first direction.

A sensor measuring properties of a substrate in which radiation is projected onto the substrate by a radiation projector that has a first part configured such that the radiation projection can project onto the substrate linearly polarized radiation oriented in a first direction and a second part configured such that the radiation projector can project onto the substrate linearly polarized radiation oriented in a second direction orthogonal to the first direction.

Lithographic system, sensor, and method of measuring properties of a substrate

A method, apparatus and computer product for processing of substrates in at least a part of a substrate processing system is provided. In an embodiment, the method includes obtaining, using a processing unit, at least one of a rate of processing and a time of processing of a plurality of substrate lots to be introduced into a part of the substrate processing system and determining, using the processing unit, an order of introduction of the plurality of substrate lots into the part of the substrate processing system to at least one of increase the rate of processing and decrease the time of processing of the plurality of substrate lots.

Method, apparatus and computer product for substrate processing

In a photolithography apparatus, accelerations of the lens unit due to vibrational disturbances are measured and used to derive a control signal which is applied to the positioning means of the wafer table and/or mask table, so as to effect compensating motions of that table. This feedforward system can be optimized to correct for motions of the lens unit in specific frequency bands, e.g. in the vicinity of the eigenfrequency of the lens.

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Eindhoven, Netherlands

Reinder Teun Plug