International Business Machines Corporation

Reinaldo Anthony Neira

Thurston Bryce Youngs, Jr

Ivan I Chobot

John A Covert

Paul C Sviedrys

Alexander Petrovich

Louise A Tiemann

Donald W Miller

Gerald A Valenta

Keith D Mansfield

Randy L Haight

Miguel Angel Jimarez

Receptor pad structures for chip carriers, and in particular, non-floating BLM C-4 receptor pads for organic chip carriers preferably utilizing eutectic solder. On the receptor pads of chip carriers, particularly in providing equal distributions of the solder so that all pad areas are equalized irrespective as the type and size of receptor pad configuration, there is a utilization of a solder mask constituted of an insulating material, and which incorporates specifically sized and shaped solder openings or windows wherein, in a particular instance, the C4 receptor pad is essentially at the intersection of a copper trace and the solder mask window. Pursuant to a particular aspect, the solder mask opening is of a polygonal configuration, whereas in other instances, as described hereinbelow, the C4 receptor pad design may be essentially of a socalled &ldquo;band aid&rdquo; or circular configuration in which a circular pad is located below and within a round solder mask opening or window. The circular pad extends within and beyond the solder mask window or opening through the intermediary of the copper trace, thereby enabling the formation of equal solder areas on all pads and eliminating the previously encountered BLM floating problem leading to potentially unreliable connections and resulting chip failures.

Receptor pad structure for chip carriers

A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.

Method of forming electronic multilayer printed circuit boards or cards

A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At least one through hole is formed through at least one of the conductive planes. An electrically conductive material is deposited onto an inside surface of the at least one through hole to form a plated through hole. At least one thermal relief passage is formed at least in the at least one of the conductive planes for preventing the diffusion of heat throughout the circuit board or card during the securing or removal or chips or other components to the circuit board or card by heating the material deposited in the at least one through hole to a temperature above its melting point. The at least one thermal relief passage is located in the vicinity of the at least one through hole and is free from electrical connection therewith. An electrically insulating material is deposited on at least one side of each of the conductive planes. The planes are placed on top of each other such that a layer of electrically insulating material is located between each of the conductive planes. The conductive planes are joined together to form the multi-layer circuit board or card.

Methods of forming electronic multi-layer printed circuit boards and/or

Printed circuit board or card thermal mass design

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Endicott, NY, United States of America

Reinaldo Anthony Neira