Henkel Kommanditgesellschaft Auf Aktien

Henkel Corporation

Other

Henkel Ag & Company, Kgaa

Cognis Corporation

Reimar Heucher

Juergen Wichelhaus

Stephen A Fischer

David I Devore

Kartar S Arora

Siegfried Kopannia

Johannes Andres

Chase J Boudreaux

Dwight D Heinrich

Michael S Wiggins

Angela Rossini

Bettina Becker

Kurt Schueller

Alasdair Crawford

Sandra Drahos

Thomas Moeller

Hans-Georg Kinzelmann

Yingjie Li

Luca Mario Marchese

Ulrike Maassen

Thomas Möller

Fabio Angelo Spada

Timothy C Vogel

Julie Joseph

Isabelle Ford

John T Cain

The present invention relates to a reactive hot melt adhesive composition, which at least partially loses its adhesiveness upon application of an electric voltage and thus allows debonding of substrates that have been bonded using said adhesive. Furthermore, the present invention relates to a method for its production and a method for forming a bonded substrate using such a reactive hot melt adhesive composition.

Debondable reactive hot melt adhesives

The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising: coating the surface of the electrically non-conductive substrate(s) with a conductive ink; applying an electrically debondable hot melt adhesive composition to the conductive ink-coated surface of the first substrate and/or the second substrate; contacting the first and the second substrates such that the electrically debondable hot melt adhesive composition is interposed between the two substrates; allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and optionally applying a voltage to the bonded substrates whereby adhesion at least one interface between the electrically debondable hot melt adhesive composition and a substrate surface is substantially weakened. Furthermore, the present invention relates to the bonded substrates thus obtained.

Electrical debonding of PU hot melt adhesives by use of conductive inks

A filling compound for electrical and optical equipment in the form of cables, connectors, plugs, etc. and to assemblies thus produced, is provided. Electrical and optical equipment in the form of cables, connectors, plugs, etc. have to be protected against harmful influences penetrating from outside, particularly water, and also against mechanical damage during laying or as a result of exposure to heat. The filling compound is based on a stellate substance, i.e. a substance having a branched molecular structure in which, ideally, 3 or more branches, more particularly polymeric chains, radiate from a single branching point. The filling compound is flexible at very low temperatures but, on the other hand, does not run out, even at extremely high temperatures.

Filling compound

Difficult-to-bond substrates possessing low surface energies are bonded with moisture curable polyurethane hot melt adhesive comprising a polyurethane prepolymer which is the reaction product of a polyol component and a polyisocyanate component, wherein said polyol component comprises a polyester polyol which is the reaction product of diacid comprising aromatic diacid and optional co-monomer diacid and diol, with the proviso that said diacid is substantially free of phthalic acid or derivatives thereof.

Moisture curable hot melt adhesive and method for bonding substrates using same

An aqueous dispersion containing a polyamide and non-polyamide polymer is prepared by dissolving the polyamide in an organic solvent with a surfactant to form a polyamide solution. Water is then added to the polyamide solution to form an aqueous dispersion. The non-polyamide polymer can be added before or after the addition of water. The polyamide/non-polyamide dispersion can be used to produce an ink with better adhesion to plastic substrates and reduced blocking problems.

Aqueous polyamide dispersion composition

A polyamide resin comprising the reaction product obtained by the reaction of an acid component comprised of a major concentration of a dimer acid and minor concentration of a monobasic acid and an amine component comprised of a major concentration of a short-chain alkylenediamine, a first minor concentration of a medium-chain alkylenediamine and second minor concentration of a polyoxyalkylene diamine having a molecular weight greater than about 500 is provided. The polyamide resin is used to form a blend of containing the polyamide in a major amount by weight and a first minor amount by weight of a polar wax and a second minor amount by weight of a polyolefin elastomer. The composition is used to reinforce a footwear upper, e.g. as a print on box toe material.

Method of manufacturing an upper for a shoe

A filling compound for electrical and optical equipment in the form of cables, connectors, plugs etc. and to assemblies thus produced, is provided. Electrical and optical equipment in the form of cables, connectors, plugs etc. have to be protected against harmful influences penetrating from outside, particularly water, and also against mechanical damage during laying or as a result of exposure to heat. The filling compound is based on a stellate substance, i.e. a substance having a branched molecular structure in which, ideally, 3 or more branches, more particularly polymeric chains, radiate from a single branching point. The filling compound is flexible at very low temperatures but, on the other hand, does not run out, even at extremely high temperatures.

A composition of matter useful as a hotmelt adhesive is provided. The composition is comprised of a polyamide based on dimerized fatty acid and having an amine value higher by at least two units than the acid value of said polyamide and a filler comprised of a carbonate. The filler is preferably comprised of fine particles of calcium carbonate. The adhesive is particularly useful for bonding metals, e.g. to plastics and the bonding of cables with multilayer sheaths, e.g. in optical cables and power cables.

Polyamide hotmelt adhesive

Polyamide compositions and related methods

A process is provided for preparing a dispersion of a polyamide in water, said process comprising:

Aqueous dispersions of polyamides

A process is provided for preparing a dispersion of a polyamide in water, said process comprising: dissolving a polyamide having an amine value of greater than about 2 in an organic solvent to form a solution of said polyamide in said solvent, said polyamide and said solvent being at a temperature below the softening point of, said polyamide during said dissolving, said solution further comprising a surfactant and an inorganic alkaline material, adding sufficient water containing an acid to said solution with mixing to form an oil-in-water dispersion, the temperature of said solution and said water being below the softening point of said polyamide during said adding, the amount of said acid being sufficient to neutralize a portion of said inorganic alkaline material, but insufficient to coagulate said polyamide from the resulting oil-in-water dispersion, and removing at least a major amount of said organic solvent from said oil-in-water dispersion. The resulting dispersion is useful in preparing a coating of the polyamide, which coating is useful as an adhesive.

Polyamide based on dimer fatty acid

Hotmelt adhesive

Moisture-curing polyamides containing reactive alkoxysilane groups and a process for their preparation are provided. The reactive alkoxysilane groups contain organic groups which are not reactive during the production process, the intended application or the curing process. These moisture-curing polyamides have low melt viscosities and are useful as sealing compounds, hotmelt adhesives and encapsulating materials.

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Pulheim, Germany

Reimar Heucher