Dexerials Corporation

Reiji Tsukao

Yasushi Akutsu

Tomoyuki Ishimatsu

Shinichi Hayashi

Takeshi Miyake

Seiichiro Shinohara

Hiroki Ozeki

Yusuke Tanaka

Masao Saito

Masahiro Iiyama

Koji Ejima

Shoko Kuga

Kenichi Hirayama

Hiromi Kubode

Masaki Taniguchi

Makoto Matsubara

Tatsurou Fukaya

In a filler-containing film in which fillers are dispersed in a resin layer, a flow of the fillers caused by an unnecessary flow of the resin layer is suppressed during the pressure bonding of the filler-containing film and an article. This filler-containing film (A) includes a filler-dispersed layer () in which fillers () are dispersed in a resin layer (). The surface in the vicinity of the fillers () of the resin layer () has concavities () and () with respect to the tangent plane to the central portion of the surface of the resin layer () between adjacent fillers (). The ratio (La/D) of a layer thickness La of the resin layer () to a particle diameter D of the filler () is preferably from 0.6 to 10.

Filler-containing film

An anisotropic conductive film capable of accommodating bumps with a narrow pitch and reducing the number density of conductive particles. In an anisotropic conductive film, conductive particles are disposed in an insulating resin binder as follows. Specifically, the conductive particles are rows of conductive particles arranged in single rows with spacing therebetween; and repeating units of conductive particles formed by juxtaposition of different numbers of conductive particles are disposed repeatedly over the entire surface of the anisotropic conductive film.

Anisotropic conductive film

A conductive tape comprising a conductive particle-containing layer containing at least a binder resin layer and a plurality of conductive particles, In this conductive tape, the plurality of conductive particles are distributedly disposed independently from each other on one surface of the binder resin layer, a surface of the binder resin layer in a vicinity of each of the conductive particles has an inclination or an undulation with respect to a tangent plane of the binder resin layer in a center portion between adjacent conductive particles, in the inclination, the surface of the binder resin layer around the conductive particle is lacked with respect to the tangent plane, and in the undulation, a resin amount of the binder resin layer right above the conductive particle is smaller than that when the surface of the binder resin layer right above the conductive particle is flush with the tangent plane.

Spacer-containing tape

A filler-containing film has a structure in which fillers are held in a binder resin layer. The average particle diameter of the fillers is 1 to 50 &#x3bc;m, the total thickness of the resin layer is 0.5 times or more and 2 times or less the average particle diameter of the fillers, and the ratio Lq/Lp of, relative to the minimum inter-filler distance Lp at one end of the filler-containing film in a long-side direction, a minimum inter-filler distance Lq at the other end at least 5 m away from the one end in the film long-side direction is 1.2 or less. The fillers are preferably arranged in a lattice form.

A filler disposition film that can use a commercially procurable filler material having good particle diameter uniformity, enables high positional precision of the filler disposition, can support even an increase in the surface area, and has a prescribed filler regularly disposed in a long resin film. Moreover, the rate of consistency of disposition of the filler in the filler disposition film in rectangular areas of a prescribed size having a length of 1000 times or more the average particle diameter of the prescribed filler, and a width of 0.2 mm or greater is 90% or greater. Such a rectangular area has a long-side direction that is substantially parallel to the long-side direction of the filler disposition film, and a widthwise direction that is substantially parallel to a short-side direction of the filler disposition film. The average particle diameter of the regularly disposed filler is from 0.4 &#x3bc;m to 100 &#x3bc;m.

Filler disposition film

An anisotropic conductive film in which conductive particles are disposed in an insulating resin layer has a particle disposition of the conductive particles such that a first orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in an a direction at a predetermined pitch, in a b direction inclined with respect to the a direction at an angle, and a second orthorhombic lattice region being formed by arranging a plurality of arrangement axes of the conductive particles, disposed in the a direction at a predetermined pitch, in a c direction obtained by inverting the b direction with respect to the a direction are repeatedly disposed.

An anisotropic conductive film which suppresses occurrence of short circuit at the time of anisotropic conductive connection, prevents reduction in capturing capability of electrically conductive particles, enables favorable pushing of electrically conductive particles and exhibits not only favorable initial conductivity but also favorable conduction reliability, contains a first electrically conductive particle group and a second electrically conductive particle group, each including a plurality of electrically conductive particles, in an insulating binder. The first electrically conductive particle group and the second electrically conductive particle group are present in a first region and a second region, respectively, which differ from each other in the thickness direction of the anisotropic conductive film and are parallel to the plane direction. Moreover, the first electrically conductive particle group and the second electrically conductive particle group differ from each other in an existence state of the electrically conductive particles.

Anisotropic conductive film and connection structure

An anisotropic conductive film can reduce the conduction resistance of an anisotropic conductively connected connection structure, and can reliably suppress the occurrence of short-circuits. The film has a structure wherein insulating particle-including conductive particles, wherein insulating particles adhere to the surfaces of conductive particles, are distributed throughout an insulating resin layer. In the insulating particle-including conductive particles, a number of insulating particles in contact with the conductive particles with respect to a film thickness direction is lower than with respect to a film planar direction. Preferably, a number of the insulating particles overlapping with the conductive particles when one of a front and rear film surface of the anisotropic conductive film is viewed in plan view is lower than a number of the insulating particles overlapping with the conductive particles when the other of the film surfaces is viewed in plan view.

A spacer-containing tape for enabling the formation of a fine and uniform gap between various members and substrates for general purposes at low cost without the necessity of performing a spacer forming step specialized for each substrate or member on which spacers are to be disposed includes a spacer-dispersed layer containing at least a binder resin layer and a plurality of spacers. In this spacer-containing tape, the plurality of spacers are distributedly disposed independently from each other on one surface of the binder resin layer. It is preferable that the spacers be distributedly disposed regularly on the one surface of the binder resin layer. The area occupancy ratio of the spacers is preferably 35% or less.

An anisotropic conductive film has first and second connection layers formed on a first layer surface. The first connection layer is a photopolymerized resin layer, and the second is thermo- or photo-cationically, anionically, or radically polymerizable resin layer. On the surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer. The first connection layer has fine projections and recesses in a surface. An anisotropic conductive film of another aspect has first, second, and third connection layers layered in sequence. The first layer formed of photo-radically polymerized resin. The second and third layers are formed of thermo-cationically or thermo-anionically polymerizable resin, photo-cationically or photo-anionically polymerizable resin, thermo-radically polymerizable resin, or photo-radically polymerizable resin. On a surface of the first connection layer on a second connection layer side, conductive particles for anisotropic conductive connection are in a single layer.

Anisotropic conductive film and production method of the same

A first anisotropic conductive filmA or a second anisotropic conductive filmB has a first insulating resin layerand a second insulating resin layer. The first insulating resin layeris formed of a photopolymerized resin, and the second insulating resin layeris formed of a polymerizable resin. Conductive particlesare disposed in a single layer on a surface of the first insulating resin layeron a side of the second insulating resin layer. The first anisotropic conductive film further has a third insulating resin layerformed of a polymerizable resin, and the second anisotropic conductive filmB has an intermediate insulating resin layer. The intermediate insulating resin layeris formed of a resin containing no polymerization initiator, and is in contact with the conductive particles. These anisotropic conductive films have favorable connection reliability.

A filler-containing film that can be precisely pressed to an electronic component with lower thrust is a film having a filler distributed layer in which fillers are regularly disposed in a resin layer, wherein an area occupancy rate of the fillers in a plan view is 25% or less, a ratio La/D between a layer thickness La of the resin layer and a particle diameter D of the fillers is 0.3 or more and 1.3 or less, and a proportion by number of the fillers present in a non-contact state with each other is 95% or more with respect to the entire fillers. The proportion by number of the fillers present in a non-contact state with each other is preferably 99.5% or more with respect to the entire fillers.

An anisotropic conductive film has a structure in which high hardness conductive particles having a 20% compression elastic modulus of 8000 to 28000 N/mmand low hardness conductive particles having a lower 20% compression elastic modulus than that of the high hardness conductive particles are dispersed as conductive particles in an insulating resin layer. The number density of all the conductive particles is 6000 particles/mmor more, and the number density of the low hardness conductive particles is 10% or more of that of all the conductive particles.

In a connection structure, a first electronic component having a first terminal pattern and a second electronic component having a second terminal pattern different in size and pitch from the first terminal pattern are anisotropically conductively connected by an anisotropic conductive film to a third electronic component having a terminal pattern corresponding to each of the first terminal pattern and the second terminal pattern. The anisotropic conductive film has at least one of a region in which conductive particles are regularly arranged, and a plurality of regions in which at least one of a number density, a particle diameter, and a hardness of the conductive particles in one region is different from that in the other region.

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Utsunomiya, Japan

Reiji Tsukao