Fujikura Limited

Reiji Higuchi

Osamu Nakao

Shouji Itou

Masahiro Okamoto

Syouji Ito

Shoji Ito

Hideyuki Fujinami

Kazuharu Kobayashi

A base material () is arranged on top of at least one first internal layer base material (), and a second internal base material () is arranged underneath the base material (). And thereafter a surface layer circuitry conductive foil () is arranged underneath the base material (), and subsequently these materials are colaminated for forming a colaminated body (). While this colaminating operation, conductive portions being formed in the base materialsare aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion () being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material () and the conductive foil () accordingly.

Multi-layer board manufacturing method thereof

The present invention provides a printed wiring board free from undercuts, which can be formed by an additive method without a dry treatment and a dry treatment apparatus, and a production method thereof. A printed wiring board of the present invention has a conductor circuit free from undercuts which is produced by carrying out additional plating to fill undercuts.

Printed wiring board and production method thereof

Multilayer board manufacturing method

A multilayer wiring board assembly component comprises: an insulating substrate component (the insulating resin layer); a conductive layerformed on one surface of said insulating substrate componentin the form of an electrode pattern; an adhesive layerformed on the other surface of said insulating substrate component; and a conductive resin compositionwith which is filled a through hole passing through said insulating substrate component, said adhesive layer and said conductive layer in order to make interlayer interconnection. The bore diameter of the conductive layer portionof the through holeis smaller than the bore diameter of the insulating resin layer portion and the adhesive layer portionto establish electrical connection between the conductive resin compositionand the conductive layerby the rare surfaceof the conductive layer

Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin filmmade of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste filler embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste filler being projected from said resin film.

Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the copper foil, resin film, and the adhesive layer, filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.

A multilayer wiring board assembly, a multilayer wiring board assembly component, and a method of manufacture thereof. The multilayer wiring board assembly is formed by laminating together a plurality of multilayer wiring board assembly components, having a flexible resin film with a copper foil bonded to one surface and an adhesive layer bonded to the other surface, opening a through hole in the copper plated resin film through the copper foil, resin film, and the adhesive layer, and filling the through hole with a conductive paste projecting from the adhesive layer and laterally extending beyond through hole opening of the copper foil.

A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are described in which it is possible to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. The multilayer wiring board assembly is laminated by laminating together a plurality of multilayer wiring board assembly components, each of which is made by preparing a copper plated resin film made of a copper plated resin film made of a resin film having adhesivity which is provided with a copper foil bonded to one surface thereof and in which a through hole is opened through said copper foil and said resin film, and a conductive paste embedded by screen printing in the through hole of said copper plated resin film from said copper foil with a leading end of said conductive paste being projected from said resin film.

Growing community of inventors

Sakura, Japan

Reiji Higuchi