University of Utah Research Foundation

Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Reid R Harrison

Hans-Hermann Oppermann

Florian Solzbacher

Richard A Normann

Michael Töpper

Matthias Klein

Cynthia Furse

Lothar Dietrich

Sohee Kim

Klaus Buschick

Chirag Sharma

An in-vivo implantable coil assembly includes a planar coil having at least one coil layer formed from conductive traces disposed in or on a polymer matrix. A ferrite platelet is bonded to a surface of the polymer matrix. Methods of making and using the in-vivo implantable coil assembly are also disclosed.

In vivo implantable coil assembly

A technique for reflectometry testing of a signal path is disclosed. The technique includes injecting a test signal based on a probe pseudo-noise sequence into the signal path and obtaining a response signal. A sliding reference pseudo-noise sequence is correlated against the response signal. Both the probe sequence and the reference sequence are generated at a chip rate. The correlation is obtained for integer chip time delays, and sub-chip resolution of a peak correlation delay is estimated from at least two samples of the correlation.

Reflectometry test system using a sliding pseudo-noise reference

Interconnect metallization schemes and devices for flip chip bonding are disclosed and described. Metallization schemes include an adhesion layer, a diffusion barrier layer, a wetable layer, and a wetting stop layer. Various thicknesses and materials for use in the different layers are disclosed and are particularly useful for metallization in implantable electronic devices such as neural electrode arrays.

Flip chip metallization method and devices

Growing community of inventors

Salt Lake City, UT, United States of America

Reid R Harrison