Endovascular Technologies, Inc.

Abbott Laboratories Corporation

Lifeport Sciences, LLC

Reid K Hayashi

Richard Roy Newhauser, Jr

Matthew J Fitz

Timothy A M Chuter

Juan I Perez

David T Pollock

Octavian Iancea

Robin W Eckert

Arnold M Escano

Shahrokh R Farahani

Aleta A Tesar

Shuji Uemura

Mark LeMere

George D Caffell

Vivianne M Holt

Tina Ton

Albert K Chin

Alfred Concemi

The present invention embodies an endovascular graft having an attachment frame connection mechanism that allows placement of the main body component in vasculature in combination with limb components. Various limb component-to-main body component attachment mechanisms are provided which ensure a reliable bond while facilitating a smaller delivery profile.

Modular graft component junctions

An apparatus and method for electrically induced thrombosis. The surgical device includes a first electrode and a second electrode. The first electrode is for placement adjacent to, near, or within a treatment site of a patient. The second electrode can be movable with respect to the first electrode. When the electrodes are charged by an electricity source, negatively charged blood components are attracted to the positively charged electrode while being repelled from the negatively charged electrode. Due to the electric potential between the adjacent electrodes, thrombosis is induced. The negatively charged blood and components form a thrombus or a clot adjacent to the positively charged electrode. The surgical device can be used to induce the otherwise natural process of thrombosis. When the surgical device is used in a treatment site such as a puncture or incision, the thrombosis can seal the opening created by the treatment site.

Apparatus and method for electrically induced thrombosis

The present invention embodies an endovascular graft having various frame-to-main body component attachment mechanisms which provide a secured bond, reduced graft material wear, and reduced delivery profile.

Endovascular graft device and methods for attaching components thereof

The present invention embodies an endovascular graft having various frame-to-main body component attachment mechanisms which provide a secure bond, reduced graft material wear, and reduced delivery profile.

An endovascular graft having one or more sensors attached to its internal and external surface, one or more power sources attached to its external surface and one or more transmitters attached to its external surface, the sensors capable of measuring pertinent parameters and each transmitter capable of transmitting signals containing pertinent parameters to one or more receiving devices located outside the patient's body. The sensors may measure pressure, temperature, blood flow, electrical potential, or any combination thereof. The sensors may be attached at specific locations on the graft material, thereby providing pertinent parameters from critical points inside the vasculature, or may be attached to form an array of sensors over the internal and external surface of the graft material, thereby providing a complete profile of pertinent parameters throughout the vasculature covered by the endovascular graft.

Endovascular graft with pressure, temperature, flow and voltage sensors

Disclosed are apparatus and methods for aiding thrombosis through the application of electric potential. In one embodiment, a hollow prosthesis is placed within a patient at a treatment site, such as at an aneurysm. The outer surface of a prosthesis is given a positive charge. The positive charge on the outer surface attracts negatively charged components of blood, thus facilitating the repair of perigraft flow. In another embodiment, a conductive wire is used to pierce a graft and enter an aneurysm sac. The wire is positively electrically charged to aid in thrombosis, thus facilitating the repair of perigraft flow.

Apparatus and method for aiding thrombosis through the application of electric potential

A system for releasing a graft within vasculature that incorporates graft bindings severed by current-generated heat in a resistive wire element. In one aspect, the graft is held by bindings threaded through a resistive wire loop formed between conducting wires attached to opposite ends of a high resistive wire element. When an external current source is applied to the conducting wires, heat generated in the resistive wire element causes the bindings to sever, thereby allowing the graft to be released within vasculature.

Electric endovascular implant depolyment system

A delivery catheter and gripping system for enabling manipulation of a prosthesis deployed or implanted at a repair site in a corporeal lumen, for repositioning of the prosthesis. The delivery catheter includes a grip at the proximal end, a jacket enlarged portion at the distal end, and a shaft therebetween, and has a channel extending therethrough, for enabling insertion, removal, expansion and compression of the gripping system. The gripping system is housed in the delivery catheter, and includes a grip and biasing spring at the proximal end, a plurality of resilient gripping elements at the distal end, and a deploying wire therebetween for enabling gripping, maneuvering, and repositioning of the prosthesis to the desired location. The catheter jacket is retracted from enclosing the gripping elements, enabling the gripping elements to expand about the prosthesis end, and is then advanced to compress the gripping elements into engagement with the prosthesis end for maneuvering thereof so as to reposition the prosthesis.

Growing community of inventors

Palo Alto, CA, United States of America

Reid K Hayashi