Protectronics Technology Corporation

Rei-Yian Chen

Chih-Yi Chang

Tung-Hsiang Liu

Ren-Haur Hwang

Chien-Shan Huang

Jui-Kuang Chang

A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductive composite material having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductive composite material is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal layer to each other. The application of double-sided metal foil clad substrate simplifies the production process of the protection device and improves its structural strength and dimensional stability.

Surface mountable laminated circuit protection device and method of making the same

An over-current protector comprised of multiple over-current protection devices each at various switching temperature and provided with positive temperature coefficient; all devices being stacked and segregated with an reinforced insulation layer and connected in parallel through a conducting mechanism each respectively provided at where in relation to both ends of the device; both conducting mechanisms constituting the terminal electrodes of the over-current protector as a whole for reducing initial resistance, increasing peak resistance, and in turn upgrading voltage withstanding performance.

Multi-layer over-current protector

A surface mountable laminated circuit protection device comprises a first metal layer including a first unit and a second unit, a first insulating layer disposed on the first metal layer, and a second metal layer disposed on the first insulated layer. There is also a composite electroplated layer containing carbon black disposed on the second metal layer, and a first conductivity composite material layer having positive temperature coefficient (PTC) characteristics disposed on the composite electroplated layer containing carbon black. Above the first conductivity composite material layer having PTC characteristics is a third metal layer. Furthermore, there is a first conducting mechanism for conducting the first metal layer and the second metal to each other; and a second conducting mechanism for conducting the third metal layer and the first metal to each other. The application of double-sided metal foil clad substrate simplifies the production process of the protection device and improves its structural strength and dimensional stability.

Growing community of inventors

Hsinchu Hsien, Taiwan

Rei-Yian Chen