Sony Semiconductor Solutions Corporation

Sony Corporation

Rohm Co., Ltd.

Rei Takamori

Hirokazu Seki

Katsuji Kimura

Go Asayama

Shinya Morita

Masanori Onodera

Ken Koseki

Shuichi Oka

Kenichi Shigenami

Tatsuro Shimizu

Masato Nishinouchi

Susumu Hogyoku

Tatsuya Ninomiya

Takahiro Akahane

Yuki Urano

Masakazu Baba

Kiyoharu Momosaki

Provided is a semiconductor device enabling the flatness of a glass substrate to be maintained and enabling the end portion of the glass substrate to be sufficiently protected. A semiconductor device according to the present disclosure includes a glass substrate that includes a first surface, a second surface provided on the opposite side of the first surface, and a first side surface provided between the first surface and the second surface, a wiring that is provided on the first and second surfaces, a metal film that covers the first side surface, and a frame that is provided further on the outer side than the metal film, and that is bonded to the metal film at the first side surface.

Semiconductor device

Provided is an imaging device that includes a first coil that moves a lens that collects light from a subject, in an optical axis direction of the light in accordance with a first magnetic field and that moves together with the lens, a second coil for moving the lens in a direction perpendicular to the optical axis in accordance with a second magnetic field, and a third coil for detecting the first magnetic field. The second coil and the third coil are arranged on a same substrate.

Imaging device

The present technology relates to an imaging device and an electronic device that enable highly accurate adjustment of a focus position and a camera shake correction position. The device includes: a lens that focuses subject light; an imaging element that photoelectrically converts the subject light from the lens; a circuit substrate including a circuit that externally outputs a signal from the imaging element; an actuator that drives the lens with a Pulse Width Modulation (PWM) waveform in at least one of an X-axis direction, a Y-axis direction, or a Z-axis direction; and a detection unit that detects a magnetic field generated by a coil included in the actuator. The actuator drives the lens to move a focus, or drives the lens to reduce an influence of camera shake. The present technology can be applied to the imaging device.

Imaging device and electronic device enabled to control position of lens

A size reduction of an image pickup module by using resin molding, including a reduction in height, area, or the like thereof is achieved in an actual product. Provided is a module, including a substrate; a semiconductor component in which a first surface of a semiconductor device manufactured by chip-size packaging is provided and fixed along a plate-shaped translucent member, and a second surface of the semiconductor device is fixed with the second surface caused to face the substrate; a frame portion made of resin and formed on the substrate to surround the semiconductor component; and an interposition member which is made of resin and with which a gap between the semiconductor component and the substrate is filled. The interposition member is connected and fixed to the frame portion to be integrated therewith.

Solid-state image pickup apparatus, method of manufacturing solid-state image pickup apparatus, and electronic apparatus

A camera module of the disclosure includes: an imaging unit that includes a plurality of pixels, acquires a first detection value in one of the pixels in a second term out of a first term, the second term, a third term, and a fourth term that are set in order, acquires a second detection value in the relevant one of the pixels in the fourth term, and obtains a pixel value of the relevant one of the pixels on the basis of a difference between the first and second detection values; a lens unit including a lens and an actuator that drives the lens; and a driver unit that generates a drive signal and drives the actuator using the drive signal, in which the drive signal makes a transition in each of the first and third terms.

Camera module and electronic apparatus

Growing community of inventors

Oita, Japan

Rei Takamori