Intel Corporation

Rehan M Sheikh

Michael T Klinglesmith

Sankaran M Menon

Rolf H Kuehnis

Abram M Detofsky

Terrence Huat Hin Tan

John Michael Peterson

Deepak Rameshkumar Tanna

Shi Hou Chong

Mohammad Al-Aqrabawi

Brad A Kelly

Sukhbinder Takhar

Antonio Castro

Kok Hin Oon

Asifur Rahman

Wai Loon Yip

Mohsen Fazlian

Yudhishthira Kundu

Disclosed herein are structures and techniques for exposing circuitry in die testing. For example, in some embodiments, an integrated circuit (IC) die may include: first conductive contacts at a first face of the die; second conductive contacts at a second face of the die; die stack emulation circuitry; other circuitry; and a switch coupled to the second conductive contacts, the die stack emulation circuitry, and the other circuitry, wherein the switch is to couple the second conductive contacts to the other circuitry when the switch is in a first state, and the switch is to couple the die stack emulation circuitry to the other circuitry when the switch is in a second state different from the first state.

Die stack override for die testing

The disclosed systems, devices, and methods may provide for wireless testing of devices and, in particular, wireless testing of semiconductor devices comprising integrated circuits, memory, and logic circuitry that can be present on a wafer. The semiconductor devices can be tested for functional defects by applying one or more test patterns to the semiconductor devices. Further, for devices under test that do not have built-in wireless connectivity (for example, those that do not have a built-in Bluetooth low-energy engine), the disclosure describes systems and methods that the devices under test can use for external wireless connectivity (e.g., an external board having Bluetooth low-energy) on the low-bandwidth interface. In one example embodiment, for high-bandwidth scan testing, wireless connectivity modules (such as those implementing WiFi or WiGig) are described, which can be used to meet the bandwidth requirements of the one or more tests.

Systems and methods for wireless device testing

A high volume manufacturing (HVM) and circuit marginality validation (CMV) test for an integrated circuit (IC) is disclosed. The IC comprises a port binding and bubble logic in the front end to provide flexibility in binding a port to the uop and to create empty spaces (bubbles) in the uop flow. The out-of-order (OOO) cluster of the IC comprises reservation disable logic to control the flow sequence of the uops and stop schedule logic to temporarily stop dispatching the uops from the OOO cluster to the execution (EXE) cluster. The EXE cluster of the IC comprises signal event uops to generate fault information and fused uJump uops to specify combination of branch prediction, direction, and resolution in any portion of the test. Such features provide a tester the flexibility to perform HVM and CMV testing of the OOO and EXE clusters of the IC.

Circuit marginality validation test for an integrated circuit

Growing community of inventors

Austin, TX, United States of America

Rehan M Sheikh