Centre D'etude Des Materiaux Organiques Pour Technologies Avancees

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Bernard Sillion

Thierry Pascal

Thermosetting Schiff base resins, their preparation and their applications re described. These thermosetting Schiff base resins can be defined as responding to the general formula: ##STR1## Radicals Ar.sub.1, Ar.sub.2 and Ar.sub.3 are chosen so that the softening temperature of the resins is less than about 150.degree. C. The resins can be prepared by direct condensation of an ethynyl benzaldehyde or acetophenone on a telechelic diamine oligomer obtained by reaction of a diamine containing flexibilizing groups on a derivative of benzhydrol tetracarboxylic acid. These Schiff base resins can be used by bulk thermal polymerization particularly to prepare adhesives or composite matrices.

Thermosetting polyimide schiff base resins, their preparation and their

Thermosetting quinazolone resins, their preparation and their applications re described. These thermosetting quinazolone resins can be defined as having the following general formula: ##STR1## in which Ar.sup.1 is a bivalent mono- or polycyclic aromatic radical and Ar.sup.2 is a bivalent aromatic radical of several simple aromatic rings bound two by two by atoms or bivalent groups. These Ar.sup.1 and Ar.sup.2 radicals are chosen so that the melting or emollescence temperature is between 80.degree. C. and 170.degree. C. The resins can be prepared from condensation of an ethynylarylbenzoxazinone with an aromatic diamine containing flexibilizing groups. These quinazolone resins can be polymerized in bulk in order to prepare adhesives or composite matrices in particular.

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