Texas Instruments Corporation

Reginald W Smith

John Walter Orcutt

Angus W Hightower

Howard Raeburn Test

George A Bednarz

Gretchen W Roeding

A method of producing a cavity package semiconductor device is disclosed. The method includes providing a bar pad having a plurality of bar pad straps, each strap extending outwardly from the outer edge of the bar pad and spaced about the edge of the bar pad; mounting integrated circuits having bond pads on the bar pad; molding a packing material onto a central portion of lead fingers and the bar straps to grip and surround each lead finger with package material, with a portion of each lead finger extending externally from the ring at both the exterior and interior thereof and to secure the bar pad straps therein; electrically coupling the bond pads to the portion of desired ones of the lead fingers extending toward the interior of the ring; and enclosing both ends of the ring to provide a cavity in the ring to suspend a bar pad with the integrated circuit thereon within the cavity with the bar pad straps.

Process of packaging a semiconductor device with reduced stress forces

An integrated circuit package having a large number of external connections is assembled using two lead frames stacked one atop the other. The lead frames have complementary lead patterns which interdigitate to provide a very close lead spacing at the periphery of a semiconductor chip on which a complex integrated circuit is fabricated.

Stacked interdigitated lead frame assembly

A carrier having a plurality of leads extending from the lateral sides thereof. The leads extending along the lateral side and over protuberances into depressions in the bottom of the carrier. Each of the depressions is separated by ribs from the other depressions. The ends of the leads disposed in the depressions are prevented from substantial movement by the rib to prevent contact with adjacent leads. At least some of the leads are provided with holes disposed adjacent to the exit of the leads from the enclosure of the carrier. The holes in the leads allow the leads greater flexibility at their portions close to the entrance of the leads into the enclosure. The leads are tapered along their length toward the protuberances. Further, the leads are separated by a width along the lateral side which is within the range of slightly greater than the width of the leads to less than the width of the leads to prevent nesting.

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Arlington, TX, United States of America

Reginald W Smith