Tektronix, Inc.

Regina R Mrozik

Julie A Campbell

Karl A Rinder

A method for acquiring a signal from an encapsulated test point on a device under test, includes forming a hole in an encapsulant adjacent to the test point, the hole extending through the encapsulant to the test point, delivering a UV-curable conductive adhesive into the hole such that the delivered adhesive contacts the test point, applying UV light from a UV light source to cure the delivered adhesive, and connecting a conductive element between the cured adhesive and a test and measurement instrument.

Encapsulated component attachment technique using a UV-cure conductive adhesive

A method of conductively bonding a test probe tip having an electrically conductive element to a device under test (DUT) having an electrical connection point, the method comprising: positioning the electrically conductive element of the test probe tip proximate to the electrical connection point of the DUT; dispensing a UV-cure conductive adhesive between the electrically conductive element and the electrical connection point of the DUT, the dispensed UV-cure conductive adhesive continuously covering at least a portion of the electrically conductive element and at least a portion of the electrical connection point of the DUT; and bonding the dispensed UV-cure conductive adhesive to the electrically conductive element and the electrical connection point of the DUT by applying UV-light from a UV-light source to the dispensed UV-cure conductive adhesive.

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Troutdale, OR, United States of America

Regina R Mrozik