Kemet Electronics Corporation

Reggie Phillips

R Allen Hill

Maurice Perea

Philip Michael Lessner

John Bultitude

John E McConnell

Garry L Renner

Keith Brown

Antony P Chacko

Lonnie G Jones

Jeffrey W Bell

Mark R Laps

Allen Hill

Alan P Webster

James B Byrd

Robert Allen Hill

John E Mcconnell

A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes:

Method for stacking electronic components

A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.

Multilayered ceramic capacitor with improved lead frame attachment

A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.

Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes

A multi-layered ceramic capacitor with at least one chip and with first base metal plates in a parallel spaced apart relationship and second base metal plates in a parallel spaced apart relationship wherein the first plates and second plates are interleaved. A dielectric is between the first base metal plates and said second base metal plates and the dielectric has a first coefficient of thermal expansion. A first termination is in electrical contact with the first plates and a second termination is in electrical contact with the second plates. Lead frames are attached to, and in electrical contact with, the terminations wherein the lead frames have a second coefficient of thermal expansion and the second coefficient of thermal expansion is higher than said first coefficient of thermal expansion. The lead frame is a non-ferrous material.

Leaded multi-layer ceramic capacitor with low ESL and low ESR

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Simpsonville, SC, United States of America

Reggie Phillips