General Electric Company

Reed Roeder Corderman

Scott Andrew Weaver

Don Mark Lipkin

Richard Arthur Nardi, Jr

Melvin Robert Jackson

Renee Bushey Rohling

Joleyn Eileen Balch

Heather Diane Hudspeth

Lauraine Denault

Paul Joseph Martiniano

Ramgopal Darolia

Joseph David Rigney

Christopher Fred Keimel

Alan Michael Iversen

Young Jin Kim

James Rollins Maughan

Anping Zhang

Ji Ung Lee

Terry Clifford Cooper

Kanakasabapathi Subramanian

Marco Francesco Aimi

Anthony Yu-Chung Ku

Kevin G McAllister

Fred Sharifi

Bernard Patrick Bewlay

Shyh-Chin Huang

Arun Virupaksha Gowda

Om Prakash

Michael James Weimer

Andrew Philip Woodfield

Jody Alan Fronheiser

Ji-Cheng Zhao

Yuk-Chiu Lau

Thomas Robert Raber

William Hullinger Huber

William Scott Walston

James Lawrence Spivack

Craig Douglas Young

Bastiaan Arie Korevaar

Rui Chen

Atanu Saha

Alex David Corwin

Jeffrey Allan Pfaendtner

Raymond Alan White

Peter Louis Andresen

Loucas Tsakalakos

John Yupeng Gui

Thomas Froats Broderick

Andrew Joseph Detor

Kuna Venkat Satya Rama Kishore

Vidya Ramaswamy

Vicki Herzl Watkins

Anthony John Murray

Parag Thakre

An-Ping Zhang

Oliver Charles Boomhower

Azar Alizadeh

Peter W Schilke

Sudhakar Reddy

Melissa Suzanne Sander

Young-Jin Kim

Shubhra Bansal

Fazila Seker

Peter Paul Gipp

Somasundaram Gunasekaran

Duraiswamy Srinivasan

Sidney Perham Young

Brian J McAndrews

John W Locker

Eddula Sudhakar Reddy

Shixue Wen

Krzysztof Slowinski

A device includes a substrate () and a metallic layer () formed over the substrate () with a deposition process for which the metallic layer () is characterizable as having a pre-determinable as-deposited defect density. As a result of a fabrication process, the defect density of the metallic layer () is reduced relative to the pre-determinable as-deposited defect density of the same layer () or another layer having like composition and which is formed under like deposition conditions. In a related method, a substrate () is provided and a removable layer () is formed over the substrate (). A metallic layer () is formed over the removable layer () and is patterned and etched to define a structure over the removable layer (). The removable layer () is removed, and the metallic layer () is heated for a time beyond that necessary for bonding of a hermetic sealing cap () thereover.

Method of forming a micro-electromechanical system device

A method of making a membrane assembly is provided. The method comprises forming an inorganic membrane layer disposed on a substrate, and forming a plurality of macropores in the substrate at least in part using anodization. Further, a membrane assembly is provided. The membrane assembly comprises a filtering membrane that is coupled to an anodized substrate comprising a plurality of macropores.

Membrane assemblies and methods of making and using the same

Provided is a device, such as a switch structure, that includes a contact and a conductive element that is configured to be deformable between a first position in which the conductive element is separated from the contact and a second position in which the conductive element contacts the contact. The conductive element can be formed substantially of metallic material configured to inhibit time-dependent deformation. For example, the metallic material may be configured to exhibit a maximum steady-state plastic strain rate of less than 10swhen subject to a stress of at least about 25 percent of a yield strength of the metallic material and a temperature less than or equal to about half of a melting temperature of the metallic material. The contact and the conductive element may be part of a microelectromechanical device or a nanoelectromechanical device. Associated methods are also provided.

Switch structure and method

A device for controlling the flow of electric current is provided. The device comprises a first conductor as thin film form; a second conductor switchably coupled to the first conductor to alternate between an electrically connected state with the first conductor and an electrically disconnected state with the first conductor. At least one conductor further comprises an electrical contact, the electrical contact comprising a solid matrix comprising a plurality of pores; and a filler material disposed within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575 K. A method to make an electrical contact is provided. The method includes the steps of: providing a substrate; providing a plurality of pores on the substrate; and disposing a filler material within at least a portion of the plurality of pores. The filler material has a melting point of less than about 575 K.

Contact material, device including contact material, and method of making

A device includes a first thermally conductive substrate having a first patterned electrode disposed thereon and a second thermally conductive substrate having a second patterned electrode disposed thereon, wherein the first and second thermally conductive substrates are arranged such that the first and second patterned electrodes are adjacent to one another. The device includes a plurality of nanowires disposed between the first and second patterned electrodes, wherein the plurality of nanowires is formed of a thermoelectric material. The device also includes a joining material disposed between the plurality of nanowires and at least one of the first and second patterned electrodes.

Thermal transfer and power generation devices and methods of making the same

The present invention relates to gated nanorod field emission devices, wherein such devices have relatively small emitter tip-to-gate distances, thereby providing a relatively high emitter tip density and low turn on voltage. Such methods employ a combination of traditional device processing techniques (lithography, etching, etc.) with electrochemical deposition of nanorods. These methods are relatively simple, cost-effective, and efficient; and they provide field emission devices that are suitable for use in x-ray imaging applications, lighting applications, flat panel field emission display (FED) applications, etc.

Gated nanorod field emitter structures and associated methods of fabrication

A method for forming an array of elongated nanostructures, includes in one embodiment, providing a substrate, providing a template having a plurality of pores on the substrate, and removing portions of the substrate under the plurality of pores of the template to form a plurality of cavities. A catalyst is provided in the plurality of cavities in the substrate, and the pores of the template are widened to expose the substrate around the catalyst so that the catalyst is spaced from the sides of the plurality of pores of the template. A plurality of elongated nanostructures is grown from the catalyst spaced from the sides of the pores of the template.

Nanostructure arrays and methods for forming same

In some embodiments, the present invention addresses the challenges of fabricating nanorod arrays comprising a heterogeneous composition and/or arrangement of the nanorods. In some embodiments, the present invention is directed to multicomponent nanorod arrays comprising nanorods of at least two different chemical compositions, and to methods of making same. In some or other embodiments, the nanorods are spatially positioned within the array in a pre-defined manner.

Patterned nanorod arrays and methods of making same

A method of making a nanostructure array including disposing a masking material on a nanoporous template such that a first number of the plurality of nanopores are fully coated while a second number of the plurality of nanopores are not-fully coated by the masking material is provided. The method includes forming the nanostructures within the plurality of nanopores that are not-fully coated by the masking material. A nanostructure array fabricated in accordance to above said method and devices based on the nanostructure array is also provided.

Nanostructure arrays and methods of making same

A self-aligned gated field emission device and an associated method of fabrication are described. The device includes a substrate and a porous layer disposed adjacent to the surface of the substrate, wherein the porous layer defines a plurality of substantially cylindrical channels, each of the plurality of substantially cylindrical channels aligned substantially parallel to one another and substantially perpendicular to the surface of the substrate. The device also includes a plurality of substantially rod-shaped structures disposed within at least a portion of the plurality of substantially cylindrical channels defined by the porous layer and adjacent to the surface of the substrate, wherein a portion of each of the plurality of substantially rod-shaped structures protrudes above the surface of the porous layer. The device further includes a gate dielectric layer disposed on the surface of the porous layer, wherein the gate dielectric layer is disposed between the plurality of substantially rod-shaped structures. The device still further includes a conductive layer selectively disposed on the surface of the gate dielectric layer, wherein the conductive layer is selectively disposed between the plurality of substantially rod-shaped structures.

Self-aligned gated rod field emission device and associated method of fabrication

A water-cooled stator bar clip for electrical generators and a method for applying a corrosion-resistant protective coating, preferably Sc, Ti, Cr, Zr, Nb, Mo, Hf, Ta, W, Ni, and Al, and their alloys or oxides to existing stator bar end fittings in order to significantly reduce the possibility of leaks through the brazed connections of the copper stator bar end connections. The coatings can be applied locally using various known physical vapor deposition ('PVD'), chemical vapor deposition ('CVD') or other direct coating techniques known in the art. For example, the coatings can be applied using ion plasma deposition, sputtering or wire arc techniques (all PVD processes) or by using electroplating, high velocity oxygen free (&#x201c;HVOF&#x201d;) deposition, DC arc or electroless plating. Preferably, the coatings are applied either to new stator bar clips or to existing clips in the field.

Corrosion protective coating for extending the lifetime of water cooled stator bar clips

A solar cell having foil electrodes. Specifically, a metal foil is implemented to form electrodes providing a reduced electron path from a dye-sensitized semiconductor material to the electrodes. In one embodiment, nanowires extending from the substrate on which the solar cell is formed are provided. In another embodiment, cavities are formed in a sheet of conductive foil by oxidation, thereby forming a semiconductive material. The semiconductive material is sensitized with a dye and an electrolyte solution is disposed in the cavities, thereby forming an array of dye-sensitized solar cells.

Dye sensitized solar cells having foil electrodes

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Niskayuna, NY, United States of America

Reed Roeder Corderman