Intel Corporation

Reece DeFrees

John Heck

Harel Frish

Mark Isenberger

Meer Nazmus Sakib

Hari Mahalingam

Aliasghar Eftekhar

Wei Qian

Saeed Fathololoumi

Kelly Christopher Magruder

Mengyuan Huang

George A Ghiurcan

Lingtao Liu

Seth M Slavin

Pegah Seddighian

Sungbong Park

Eddie Bononcini

Stanley J Dobek

Walter Garay

Cung Tran

A method may include: forming a base layer on a substrate; forming a waveguide assembly on the base layer, where the waveguide assembly is surrounded by a cladding layer; forming a trench opening through the cladding layer and the base layer; forming an undercut void by etching the substrate through the trench opening, where the undercut void extends under the waveguide assembly and the base layer; and filling the trench opening with a filler to seal off the undercut void. Other embodiments are described and claimed.

Heating of thermo-optic device

Embedded three-dimensional electrode capacitors, and methods of fabricating three-dimensional electrode capacitors, are described. In an example, an integrated circuit structure includes a first metallization layer above a substrate, the first metallization layer having a first conductive structure in a first dielectric layer, the first conductive structure having a honeycomb pattern. An insulator structure is on the first conductive structure of the first metallization layer. A second metallization layer is above the first metallization layer, the second metallization layer having a second conductive structure in a second dielectric layer, the second conductive structure on the insulator structure, and the second conductive structure having the honeycomb pattern.

Embedded three-dimensional electrode capacitor

Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler including an optical waveguide to guide light to an optical fiber. In embodiments, the optical waveguide includes a tapered segment to propagate the received light to the optical fiber. In embodiments, the tapered segment is buried below a surface of a semiconductor substrate to transition the received light within the semiconductor substrate from a first optical mode to a second optical mode to reduce a loss of light during propagation of the received light from the optical waveguide to the optical fiber. In embodiments, the surface of the semiconductor substrate comprises a bottom planar surface of a silicon photonic chip that includes at least one or more of passive or active photonic components. Other embodiments may be described and/or claimed.

Optical device including buried optical waveguides and output couplers

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Rio Rancho, NM, United States of America

Reece DeFrees