Intel Corporation

Rebecca Z Loop

Christopher E Cox

Christopher P Mozak

Kuljit Singh Bains

Rajat Agarwal

Robert J Royer, Jr

Xiang Li

Theodros Yigzaw

Justin J Song

Nagi Aboulenein

Bilal Khalaf

John G Holm

Subhankar Panda

Xiuting C Man

Kjersten E Criss

Konika Ganguly

Anthony M Constantine

Omar Avelar Suarez

Gaurav Porwal

Lawrence A Cooper

Brian P Moran

A memory subsystem with error checking and scrubbing (ECS) logic on-device on the memory can adapt the rate of ECS operations in response to detection of errors in the memory when the memory device is in automatic ECS mode. The ECS logic can include an indication of rows of memory that have been offlined by the host. The ECS logic can skip the offlined rows in ECS operation counts. The ECS logic can include requests or hints by the host to have ECS operations performed. An internal address generator of the ECS logic can select between generated addresses and the hints. The system can allow a memory controller to detect multibit errors (MBEs) related to a specific address of the associated memory. When the detected MBEs indicate a pattern of errors, the memory controller triggers a row hammer response for the specific address.

Adaptive internal error scrubbing and error handling

An apparatus is described. The apparatus includes a package on package structure. The package on package structure includes an upper package and a lower package. One of the packages contain memory devices of a first type and the other of the packages contain memory devices of a second type. I/O connections on the underside of the upper package's substrate are vertically aligned with their corresponding, first I/O connections on the underside of the lower package's substrate. The first I/O connections are located outside second I/O connections on the underside of the lower package's substrate for the lower package.

I/O layout footprint for multiple 1LM/2LM configurations

Dynamic monitoring of current draw by a memory device or memory subsystem can enable a power management system to adjust a memory access performance parameter based on monitored power usage. The system can generate a power usage characterization for the memory device and/or memory subsystem based on monitoring current draw for a known pattern, and then subsequently use the power usage characterization to determine how to adjust the memory access performance parameter.

Dynamic power measurement and estimation to improve memory subsystem power performance

In one embodiment, a system on a chip (SoC) includes a plurality of processor cores and a memory controller to control communication between the SoC and a memory coupled to the memory controller. The memory controller may be configured to send mirrored command and address signals to a first type of memory device and to send non-mirrored control and address signals to a second type of memory device. Other embodiments are described and claimed.

Mirroring memory commands to memory devices

A mechanism is described for facilitating dynamic multi-mode memory packages in memory systems according to one embodiment of the invention. A method of embodiments of the invention includes maintaining a plurality of memory modes on a single memory package at a motherboard of a computing system. The plurality of memory modes is associated with a plurality of physical organizations of memory devices. The method may further include receiving a request to switch from a first memory mode to a second memory mode of the plurality of memory mode, and dynamically switching from the first memory mode to the second memory mode, in response to the request.

Mechanism for facilitating dynamic multi-mode memory packages in memory systems

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Hillsboro, OR, United States of America

Rebecca Z Loop