International Business Machines Corporation

Raymond L Ricci

Gary Dean Anderson

Roger A Rippens

Kamalesh S Desai

Eric B Hultmark

Ernest N Urfer

Lawrence G Mosher

Gerald J Hladik

Carl L Eggerding

Frank P Presti

Henry Yeh

John A Ferrante

Bruce E Blake

A system for interconnecting an intelligent controller to a plurality of terminal devices includes a software module, a microprocessor and a device adapter having a plurality of output ports. The system operates under the control of said software module. When the system is powered up, a status for the output ports is assumed and tested under control of a configuration register. If the test is successful, the terminal port remains in that state; if unsuccessful, the state of the terminal port is reversed. The system permits an exchange of operating modes in the terminal devices associated with one port without adversely affecting operation of the remaining ports in the system.

Dynamic port reconfiguration

A ceramic card assembly which provides high density three dimensional semiconductor device packaging and overcomes the power distribution and thermal management problems that have impaired prior ceramic cards. The ceramic card assembly combines ceramic cards with flexible power distribution structures which provide low inductance and low resistance power distribution, making ceramic cards available for high performance VLSI systems. Each ceramic card assembly comprises a ceramic card having a plurality of chip sites and power contacts thereon, and at least one flexible power distribution structure having alternating insulation (i.e. polyimide) layers and conductor (i.e., copper) layers, the flexible power distribution structures are mounted adjacent to the ceramic cards so that conductive layers of the ceramic cards are selectively exposed to the power contacts. The ceramic card assemblies are preferably combined into a field replaceable unit that includes cold plates between ceramic cards. High density packages further include ceramic in-line packages which quadruple current day memory density.

Ceramic card assembly having enhanced power distribution and cooling

A process and a solid plane structure for minimizing delamination during sintering in the fabrication of multi-layer ceramic substrates, wherein the solid plane structure is designed to obtain maximum ceramic to ceramic interface contact.

Process and structure for minimizing delamination in the fabrication of

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Kingston, NY, United States of America

Raymond L Ricci