Diemat, Inc.

Namics Corporation

Other

Quantum Materials Corporation

Raymond L Dietz

David Martin Peck

Maciej Patelka

Noriyuki Sakai

Hiroshi Yamaguchi

Pawel Czubarow

Akito Yoshii

Cathy Shaw Trumble

Yukinari Abe

Pawl Czubarow

Alexander Rogachevsky

Takashi Sakamoto

A method of manufacturing a bonded body in which a first body and a second body are bonded using a glass paste. The glass paste includes a crystallized glass frit (A) and a solvent (B). A remelting temperature of the crystallized glass frit (A) is higher than a crystallization temperature thereof which is higher than a glass transition temperature thereof. The method includes: applying the glass paste on at least one of the first and second bodies, bonding the first and second bodies by interposing the glass paste therebetween, heating the bonded first and second bodies to a temperature that is not lower than the crystallization temperature and lower than the remelting temperature of the crystallized glass frit (A), and obtaining the bonded body by cooling the bonded first and second bodies to a temperature that is not higher than the glass transition temperature of the crystallized glass frit.

Method of manufacturing bonded body

A glass frit having a low melting point containing (A) AgO, (B) VO, and (C) at least one first oxide selected from the group consisting of MoO, ZnO, CuO, TiO, BiO, MnO, MgO, NbO, BaO and PO. The glass frit preferably contains 40 to 70% by mass of (A), 10 to 40% by mass of (B), and 0.5 to 30% by mass of (C) with respect to the total mass in terms of oxides. Furthermore, the glass frit preferably has a mass ratio (AgO/VO) of (A) to (B) of 1.8 to 3.2.

Glass frit

A conductive paste including (A) conductive particles, (B) a glass frit containing substantially no lead, arsenic, tellurium, and antimony, and (C) a solvent. The glass frit (B) has a remelting temperature of 320 to 360&#xb0; C., wherein the remelting temperature is indicated by a peak top of at least one endothermic peak having an endotherm of 20 J/g or more in a DSC curve as measured by a differential scanning calorimeter. The conductive paste can also include at least one metal oxide (D) selected from the group consisting of tin oxide, zinc oxide, indium oxide, and copper oxide. The glass frit (B) can further include (B-1) AgO, (B-2) VO, and (B-3) MoO. The conductive paste can achieve binding at a relatively low temperature (such as 370&#xb0; C. or lower) and maintains a bond strength at a relatively high temperature (such as 300 to 360&#xb0; C.).

Conductive paste and method for producing a semiconductor device using the same

Conductive compositions which are useful as thermally conductive compositions and may also be useful as electrically conductive compositions are provided. The compositions include a conductive particle constituent in combination with a sintering aid which can, for example be a compound of the same metal in the nanometal, an organo-metallic, a metalorganic salt, mercaptan and/or resinate. In some embodiments the conductive particles include a small amount of nanoscale (&#x3c;200 nm) particles. The compositions exhibit increased thermal conductivity.

Conductive composition

Adhesive paste of polymer resin, fugitive liquid and particulate filler with round edges provides improved performance characteristics.

Thermally enhanced electrically insulative adhesive paste

A fiber optic feed-through tube, a method for making it and a method for hermetically sealing and aligning lightwave waveguides inserted into the tube. The feed-through tube is preferably a metal tube with low melting point hermetic sealing material deposited on one end and the lightwave waveguide is an optical glass fiber. The fiber is fed through a tube having low melting point hermetic sealing material on one end.

Fiber optic feed-through tube and method for making the same

A thermosetting adhesive paste exhibiting a high thermal conductivity suitable for die attach applications.

High thermally conductive polymeric adhesive

Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.

Polymeric adhesive paste

A metal/glass paste composition with a high metal to glass ratio and a method of using the paste to adhesively connect an integrated circuit to a ceramic substrate. The glass composition consists essentially of, by weight percent on an oxide basis:

Low temperature glass paste with high metal to glass ratio

A glass composition and method of use having unique crystallization and crystal remelt properties is disclosed. The glass composition consists essentially by weight percent on an oxide basis:

Low temperature glass paste with improved thermal stress properties

Adhesive paste containing polymeric resin

Low temperature glass with improved thermal stress properties and method

A stable Tl.sub.2 O.sub.3, V.sub.2 O.sub.5, P.sub.2 O.sub.5 glass composition for a die attach paste requiring no resin and having a glassy edge temperature of below about 350.degree. C.

Growing community of inventors

Georgetown, MA, United States of America

Raymond L Dietz