Compagnie Internationale Pour L'informatique Cii-honeywell Bull (societe

Compagnie Internationale Pour L'informatique Cii-honeywell Bull

Compagnie Internationale L'informatique-cuu Honeywell Bull

Raymond L Delorme

Henri Grosjean

Pierre Louis Sigel

The invention relates to an automatic machine for bending the extending conductors of an integrated circuit chip to form contacts for mounting the chip to a substrate. This machine comprises a bending base (20), movable bending pieces (18, 19) situated opposite the bases, a ribbon insulating support (2) for the chip (1), and a platform (27) to displace the support of the chip so as to being the chip onto the base, or to remove it therefrom. This machine is characterized in that the bending base (20) includes a housing (21) having the form of the chip for receiving the chip and having a plane rim (23) adapted to surround the body of the chip. The first movable piece (18) is located in the second movable piece and has a flat rim (24) opposite the flat rim (23) of the base. The extending conductors are wedged during the bending operation between these two rims (23, 24) and the bending is carried out by the second movable piece (19) which moves rectilinearly in a vertical direction.

Machine for bending conductors of a semiconductor chip device

A positioning system for electrical components to be mounted on a carrier includes establishing a first reference system and bringing the carrier on which the components are to be mounted to a predetermined position in relation to the first system. The locations for the articles to be mounted on the carrier are defined. A second reference system is established with respect to the first reference system and the carrier is positioned in relation to the articles to be mounted on the carrier using the second reference system. Each reference system is defined by at least three fixed points against which the carrier comes to bear and the points of the second reference system duplicate the points of the first reference system so that the carrier is in the exact position to enable the components to be mounted at the exact predetermined location.

Apparatus for positioning electrical components relative to a carrier

A tool for micro-soldering the connecting tags of an integrated circuit chip to corresponding terminals on a substrate by Joule heating includes a high conductivity bit having a planar bottom face adapted to contact the tags and press them against the terminals while applying sufficient heat to the tags to solder them to the terminals. The face has a perimeter and a centrally apertured portion adapted to receive and accommodate the circuit chip. The apertured portion forms a geometric loop on the planar face having opposite sides spaced from each other and adapted to contact the tags of the chip. A continuous high electrical conductivity flange extends upwardly from all portions of the perimeter of the face to provide rigidity to the bit. A pair of high conductivity strips extend from facing segments of the flange for applying current to and removing current from the flange on opposite sides of the loop so that a pair of symmetrical current half loops extend about the face between the opposite sides thereof. Each strip has a reduced cross-sectional area symmetrical with the side of the face and removed from the intersection of the strip with the flange.

Micro-soldering tool

Method and apparatus to enable integrated circuit chips to be accurately mounted on substrates. Each chip is precisely positioned with respect to connecting areas on the substrates to which it is soldered. To this end, a support block is movable horizontally along a predetermined path and adapted to receive a substrate provided with at least one set of connecting areas arranged in a predetermined configuration about a center. A cutting tool having on the one hand a cutting head movable along a working axis perpendicular to the path followed by the support block is arranged to pass through a first fixed point on the said path, and on the other hand a cutting die arranged in the path of the head is arranged to receive an integrated circuit chip mounted on a support. A soldering tool is provided consisting of a soldering head movable along a working axis parallel to the working axis of the cutting tool and which passes through a second fixed point on the path followed by the support block, along with a positioning assembly whose positioning axis is parallel to the working axes and passes through a third fixed point on the path followed by the support block. The substrate is shifted with respect to the support block to cause the center of a set of connecting areas to coincide with the said positioning axis, and the support block is locked in position under the cutting tool and then under the soldering tool in such a way that a reference on the said support block successively occupies, with respect to the respective working axis of the two tools, the same positions as occupied with respect to the positioning axis. Finally, actuating means are included to control the movements of the cutting and soldering heads.

Growing community of inventors

Bagnolet, France

Raymond L Delorme