Asml Netherlands B.v.

Raymond Jacobus Knaapen

Sander Frederik Wuister

Johan Frederik Dijksman

Yvonne Wendela Kruijt-Stegeman

Krassimir Todorov Krastev

Aleksey Yurievich Kolesnychenko

Klaus Simon

Karel Diederick Van Der Mast

Ivar Schram

Gerard Kums

Gerard Johannes Pieter Nijsse

Jan Bex

An imprint lithography apparatus is disclosed that has a first array of template holders, a second array of template holders, and a substrate table arranged to support a substrate to be imprinted, wherein the first array of template holders is arranged to hold an array of imprint templates that can be used to imprint a first array of patterns onto the substrate, and the second array of template holders is arranged hold an array of imprint templates that can be used to imprint a second array of patterns onto the substrate, the patterns imprinted by the second array being interspersed between the patterns imprinted by the first array.

Imprint lithography

A method of aligning an imprint template with respect to a target region of a substrate is disclosed, the method including depositing a volume of an imprintable medium within the target region; contacting an imprint template to the imprintable medium so that the imprintable medium is compressed and allowing the imprint template, the target region, or both, to move laterally with respect to each other under interfacial tension forces between the target region and the imprint template, wherein a material which is less wetting than the substrate is provided in a configuration which at least partially surrounds the target region of the substrate.

Alignment for imprint lithography

A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.

MEMS device and assembly method

Growing community of inventors

Helmond, Netherlands

Raymond Jacobus Knaapen