Other

Advanced Inquiry Systems, Inc.

Raymond J Werner

Morgan T Johnson

Frank J Smith

William J Jennings

Lawrence H Walls

Jeffrey Beri

Daniel L Crowley

Collecting process characterization data local to a failed integrated circuit (IC), includes providing a wafer having ICs, each IC having contact terminals, the wafer having process characterization test sites distributed across it such that at least one process characterization test site is adjacent each IC; selecting two or more ICs for simultaneous testing; for each of those ICs, coupling two or more contact terminals of the selected IC, and a corresponding two or more contact terminals of an associated test site to corresponding input terminals of a multiplexer, each multiplexer having an output terminal and a select control input terminal, the multiplexer operable to selectively provide an electrical pathway between either an IC contact terminal or a test site contact terminal and the multiplexer output terminal; coupling the output terminal of each multiplexer to a tester channel; operating the multiplexer so that its output terminal is coupled to the IC contact terminal; simultaneously testing two or more ICs; detecting a failure of at least one of the selected ICs prior to completion of testing the remaining ICs simultaneously being tested; subsequent to detecting the failure, operating the multiplexer so that its output terminal is coupled to the test site contact terminal; and collecting process characterization data prior to completion of testing the remaining ICs.

Methods and apparatus for collecting process characterization data after first failure in a group of tested devices

Methods and apparatus for producing fully tested unsingulated integrated circuits without probe scrub damage to bond pads includes forming a wafer/wafer translator pair removably attached to each other wherein the wafer translator includes contact structures formed from a soft crushable electrically conductive material and these contact structures are brought into contact with the bond pads in the presence of an inert gas; and subsequently a vacuum is drawn between the wafer and the wafer translator. In one aspect of the present invention, the unsingulated integrated circuits are exercised by a plurality of test systems wherein the bond pads are never physically touched by the test system and electrical access to the wafer is only provided through the inquiry-side of the wafer translator. In a further aspect of the present invention, known good die having bond pads without probe scrub marks are provided for incorporation into products.

Fully tested wafers having bond pads undamaged by probing and applications thereof

A location-aware product includes a location information resource for providing the present location of the location-aware product to within some margin of error, and such present location information is included by the location-aware product in various outputs, including but not limited to, location stamps in files for create, open, and/or modify file operations. In a further aspect, location information may be used in determining the time zone or zones in which one or more operations have occurred, and to provide the basis for updating clocks, or other resources, useful for time stamping of various operations and outputs. In a still further aspect of the present invention, information displays may be sorted by accounting for the differences in times and dates introduced through time stamping of events in different time zones.

Location-based operations for information handling systems

A location monitoring system for tracking an object relative to a virtual boundary via telecommunication infrastructure for use in an electronic-commerce environment. In one embodiment the system includes a wireless communications network and the telecommunications infrastructure to dynamically configure the virtual boundary, by controlled, subscription-based access to the location monitoring system.

Method and system of configuring a boundary and tracking an object thereby

Polyolefenic compositions are formed from a mixture of polyethylene and amorphous polypropylene, or a mixture of isotactic polypropylene, amorphous polypropylene and polyethylene, wherein the polyolefenic compositions are forced under heat and pressure through a shaping die thereby forming a geometrically-shaped polyolefenic article having a non-tacky surface. The compositions can have additives, fillers and other polymeric resins incorporated therein for modification of the physical and chemical properties of the polyolefenic compositions.

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Portland, OR, United States of America

Raymond J Werner