Analog Devices International Unlimited Company

Silicon Laboratories Inc.

Analog Devices Global

Analog Devices Global Unlimited Company

Raymond J Speer

Alfonso Berduque

Donal McAuliffe

Brendan Cawley

Leon Cavanagh

Peter Smith

Patrick Martin McGuinness

William Allan Lane

Helen Berney

Youri Ponomarev

Jane Blake

Rizwan Gill

Oliver J Kierse

John Blake Pavelka

Shane Patrick Geary

Rigan McGeehan

Shane Geary

Brian J Coffey

Gerald Blaney

Donal Mcauliffe

Patrick Mcguinness

Brian Coffey

Donal Peter Mcauliffe

Electrochemical sensors () include at least two electrodes (A, HOB), over which an electrolyte () is formed. The electrodes are isolated from one another in order for reduction/oxidation reactions to occur at the electrodes and for an electric current to flow therebetween. The present disclosure describes the use of a barrier () in the electrochemical sensor that is configured to isolate electrodes from one another for the purpose of preventing electrode shorting. Additionally, the physical structure of the barrier can also act as a stencil for shaping the electrodes.

Electrochemical sensor with barrier isolating the electrodes from each other and method of forming thereof

An electrochemical sensor is provided which may be formed using micromachining techniques commonly used in the manufacture of integrated circuits. This is achieved by forming microcapillaries in a silicon substrate and forming an opening in an insulating layer to allow environmental gases to reach through to the top side of the substrate. A porous electrode is printed on the top side of the insulating layer such that the electrode is formed in the opening in the insulating layer. The sensor also comprises at least one additional electrode. The electrolyte is then formed on top of the electrodes. A cap is formed over the electrodes and electrolyte. This arrangement may easily be produced using micromachining techniques.

Electrochemical sensor, and a method of forming an electrochemical sensor

A cap for use with devices, such as sensors. The cap includes protrusions on its underside, to restrict the movement of a liquid or a gel placed under cap. The protrusions may take the form of walls or pillars, depending on the application. As such, the cap retains the liquid or gel in a specified position on the device. For example, an electrochemical sensor may require a liquid electrolyte to remain in place over one or more electrodes. The protrusions may not extend far enough to touch the device, but rather leave a small gap. However, because of the surface tension of the liquid, the liquid generally stays within the protrusions.

Retaining cap

Electrochemical sensors can include at least two electrodes, over which an electrolyte is formed. The electrodes can be isolated from one another in order for reduction/oxidation reactions to occur at the electrodes and for an electric current to flow therebetween. The present disclosure describes the use of a barrier in the electrochemical sensor that is configured to isolate electrodes from one another for the purpose of preventing electrode shorting. Additionally, the physical structure of the barrier can also act as a stencil for shaping the electrodes.

Electrochemical sensor and method of forming thereof

Electrochemical sensors include a housing within which an electrolyte is provided over the electrodes. The housing includes an active region, which is the area around the electrodes in which the electrolyte must be positioned to ensure correct operation of the device. The inner walls, base and ceiling of the housing are coated in either hydrophobic or hydrophilic materials, or both, so as to encourage the electrolyte to take a position over the active region, which is defined by the position of the electrodes. In some electrochemical sensors, a combination of hydrophobic and hydrophilic materials is used and the materials can be arranged in a pattern, which encourages the electrolyte to take a position over the active region.

A gas sensor package is disclosed. The gas sensor package can include a housing defining a first chamber and a second chamber. An electrolyte can be provided in the first chamber. A gas inlet can provide fluid communication between the second chamber and the outside environs. The gas inlet can be configured to permit gas to enter the second chamber from the outside environs. An integrated device die can be mounted to the housing. The integrated device die can comprise a sensing element configured to detect the gas. The integrated device die can have a first side exposed to the first chamber and a second side exposed to the second chamber, with the first side opposite the second side.

Gas sensor packages

An integrated circuit gas sensor system may include an integrated circuit having a bond pad layer and a dielectric layer formed after the bond pad layer. A conductor layer may be above the dielectric layer. The conductor layer may be utilized to form both gas sensor and humidity sensor conductor patterns, which may be planar. In one embodiment, the gas sensor is combined with a humidity sensor, the gas sensor and the humidity sensor covering more than 50% of the top surface of the integrated circuit. In one embodiment, the central region of the integrated circuit has a majority of its surface area utilized for the sensor structures, and in a more preferred embodiment has more than 80% of its surface area utilized for sensing structures. In one embodiment, resistive sensing may be utilized for the gas sensor and capacitive sensing may be utilized for the humidity sensor.

Integrated gas sensor

Systems and methods are provided for packaging integrated circuit (IC) gas sensor systems that employ at least one gas sensor that is formed as part of an integrated circuit and configured to sense the presence and/or concentration of a target gas or other gas characteristics that may be present in the ambient gaseous environment surrounding the packaged IC gas sensor system.

Systems and methods for packaging integrated circuit gas sensor systems

Gas sensor materials and methods are disclosed for preparing and using the same to produce gas sensor structures. Also disclosed are gas sensor structures and systems that employ these disclosed materials. A gas sense-enhancing metal such as platinum may be added to a gas sensitive metal oxide material in a manner that more highly disperses the added platinum than conventional methods so as to more effectively utilize the platinum at a lower concentration, thus achieving a more cost effective solution. An ink vehicle may also be used for deposition of a gas sensitive material (e.g. on the surface of integrated circuit) that is formulated to allow 'burn-out' of ink vehicle components at relatively low temperatures as compared to conventional ink vehicles.

Gas sensor materials and methods for preparation thereof

Methods and materials for forming gas sensor structures

Growing community of inventors

Dalkey, Ireland

Raymond J Speer