International Business Machines Corporation

Raymond J Rosner

Jeffrey P Gambino

Johann Greschner

Howard L Kalter

H Bernhard Pogge

Daniel Nelson Maynard

Leendert M Huisman

Richard L Rassel

Glen E Richard

Kevin N Ogg

Thomas Webster Bartenstein

Douglas C Heaberlin

Jeanne P Bickford

Nazmul Habib

Susan K Lichtensteiger

Leah M P Pastel

Leah M Pastel

Edward Kelley Evans

Joseph W Yoder

L Owen Farnsworth

Jeanne Paulette Spence Bickford

Thomas S Barnett

Francis Woytowich

Andrew S Wienick

Edward E Horton, Iii

Sean Horner

Thomas F Mechler

An apparatus, method, and program product are provided to predict yield loss associated with performance screens or leakage screens. A leakage model is correlated to an on-chip measurement. Current limited yields are determined from the leakage model. A database is formed relating performance sigma cut-points to the circuit limited yields. A product is quoted based on the circuit limited yield for one of the performance sigma cut-points taken from the database. The quote is tied to the product design and testing.

Methods, apparatus, and program products to optimize semiconductor product yield prediction for performance and leakage screens

A complementary metal-oxide-semiconductor (CMOS) image sensor comprises a first photosensitive diode comprising a first semiconductor material is formed in a first semiconductor substrate. A second photosensitive diode comprising a second semiconductor material, which has a different light detection wavelength range than the first semiconductor material, is formed in a second semiconductor substrate. Semiconductor devices for holding and detecting charges comprising a sensing circuit of the CMOS image sensor may also be formed in the second semiconductor substrate. The first semiconductor substrate and the second semiconductor substrate are bonded so that the first photosensitive diode is located underneath the second photosensitive diode. The vertical stack of the first and second photosensitive diodes detects light in the combined detection wavelength range of the first and second semiconductor materials. Sensing devices may be shared between the first and second photosensitive diodes.

Optical sensor including stacked photodiodes

Optical sensor including stacked photosensitive diodes

A method and system for predicting manufacturing yield for a proposed integrated circuit The method includes: in the order recited: (a) providing a multiplicity of different integrated circuit library elements in a design database, each library element linked to a corresponding normalization factor in the design database; (b) selecting library elements from the design database to include in a proposed design for the integrated circuit; (c) generating an equivalent circuit count of the proposed design based on the normalization factors and a count of each different library element included in the proposed design; and (d) calculating a predicted manufacturing yield based on the equivalent circuit count, a predicted density of manufacturing defects and an area of the proposed integrated circuit chip.

Method for modeling integrated circuit yield

A method of testing a semiconductor device having a memory is disclosed. The method includes selecting a portion of the memory; testing the selected portion of the memory; designating the selected portion of the memory as a designated memory in response to an acceptable testing result; and storing data in the designated portion of the memory for retrieval at a later time. Provision for soft repair of the selected memory is made. Test data can be compressed before being stored in the designated memory.

Internal cache for on chip test data storage

An incremental fault dictionary in which the diagnostic simulation results of current tests are stored for future use. Diagnostic simulation results are incrementally added to the fault dictionary, and information in the incremental fault dictionary is used to avoid expensive redundant fault simulations. The size of the incremental fault dictionary is maintained within user definable bounds by identifying and deleting faults that need not be maintained in the incremental fault dictionary. The incremental fault dictionary beneficially provides more accurate and faster diagnostics than a typical prior art diagnostic fault simulation.

Incremental fault dictionary

Disclosed is an integrated circuit configuration including a carrier having recesses for supporting individual semiconductor die units. The semiconductor die units and the carrier recesses have lithographically defined dimensions so as to enable precise alignment and a high level of integration.

Very dense integrated circuit package and method for forming the same

Very dense integrated circuit package

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Colchester, VT, United States of America

Raymond J Rosner