Smartrac I.p. B.v.

Neology, Inc.

Raymond Freeman

Manfred Rietzler

Joe Mullis

Sheshi Nyalamadugu

Birektawit Waktola

Alexander Boellaard

Embodiments described herein provide various examples of a low cost, low power, fully automated, unobtrusive, and vehicle-independent radio frequency (RF) communication device to be plugged into a standard on-board diagnostic (OBD) port inside a vehicle to access OBD diagnostic data. According to one aspect, an OBD device for a vehicle is disclosed. This OBD device includes: an OBD adapter configured to be plugged into an OBD port of a vehicle and a first RFID module electrically coupled to the OBD adapter. The first RFID module is further configured to receive OBD data of a vehicle from an associated OBD port via the OBD adapter and communicate at least a portion of the received OBD data to a first RFID reader when the first RFID module is queried by the first RFID reader.

Embedded on-board diagnostic (OBD) device for a vehicle

An antenna arrangement for a chip card includes an antenna conductor structure that is formed from a surface conductor. The antenna conductor structure includes a dipole arrangement arranged on a card substrate and that has a first antenna strand and a second antenna strand. The antenna conductor structure includes a terminal arrangement connecting the antenna conductor structure to a chip and for forming a transponder including the antenna conductor structure and the chip. A surface of the card substrate is divided into a grasping zone for handling the chip card and a transponder zone for arranging the transponder in such a manner that the grasping zone extends beyond a center region of the substrate surface and at least one lateral edge of the grasping zone is formed by a lateral edge of the substrate surface.

Antenna arrangement for a chip card

A chip carrier for contacting with a chip and an antenna is disposed on an antenna substrate. The chip carrier features a carrier substrate having a chip contact arrangement located at a distance from longitudinal ends of the carrier substrate for electrical contacting with a chip. The carrier substrate includes two antenna contact surfaces having the chip contact arrangement therebetween for electrical contacting with the antenna. The chip contact arrangement and the antenna contact surfaces are located on an application surface of the chip carrier. At least one insulation surface-is formed on the application surface between the chip contact arrangement and the antenna contact surfaces.

Chip carrier for a transponder module and transponder module

The present invention relates to an antenna arrangement () for the production of chip cards, in particular chip cards used in the UHF frequency range, having a substrate and a plurality of antenna conductor structures () formed on the substrate using a coating method, the antenna conductor structures having a terminal arrangement () for connecting the antenna conductor structures to a chip, wherein the substrate is formed as a substrate sheet (), and the antenna conductor structures are disposed on the substrate sheet in a matrix arrangement () having a plurality of columns and rows.

Antenna for chip card production

A method for application of a chip module to an antenna module includes supplying a plurality of chip modules arranged in a row arrangement on a sheet carrier. Separating chip modules from the row arrangement and transferring the separated chip modules to a application device. The chip module separated from the row arrangement are subsequently positioned on the antenna substrate by the application device and contacting of the antenna contact surfaces of the chip module with the contact surfaces of the antenna is performed. The invention further relates to a device for the application of a chip module to an antenna module.

Method for application of a chip module to an antenna

The present invention relates to a layered composite () for producing a card body comprising a chip module () for a chip card, having a substrate layer arrangement () for arranging the chip module, and having intermediate layers () disposed on both sides of the substrate layer arrangement, each having a cover layer (), wherein the substrate layer arrangement and the cover layers are designed in relation to the intermediate layers such that the substrate layer arrangement and the cover layers are formed as layers having a relatively rigid shape and hard surfaces, and the intermediate layers are formed as layers having a relatively elastic shape and soft surfaces, and also relates to a method for producing a layered composite.

Layered composite for a card body and method for producing the layered composite

The present invention relates to a chip card and a method for the production of a chip card having a chip () which is arranged in a card body, and having a plurality of components () being electrically conductively connected to the chip by means of a conductor arrangement (), wherein the card body is composed of a plurality of substrate layers () which are arranged in a layer structure, wherein the components and the conductor arrangement are arranged in different substrate layers, specifically a component layer arrangement and a connecting layer arrangement, and have contact surfaces (), which are disposed so as to overlap one another, for producing an electrically conductive contacting.

Growing community of inventors

Mesa, AZ, United States of America

Raymond Freeman