Lucent Technologies Inc.

Western Electric Company, Inc.

Raymond Frank Gruszka

Joseph Michael Freund

George John Przybylek

Dennis Mark Romero

John S Rizzo

John E Boyd

Gustav Edward Derkits, Jr

Patrick J Drummond

Ping Wu

David J Zangari

Nancy Louise Reyes

Clarence A Warczyglowa

A scribing machine adapter plate is configured to receive and couple a hoop assembly to a chuck on a scribing machine. The adapter plate includes an upper surface and an inner annular vacuum groove and an outer annular vacuum groove formed in the upper surface. A third vacuum groove extends radially between, and communicates with, the inner and outer grooves. The outer vacuum groove includes a vacuum inlet hole that extends from the groove through the adapter plate to provide communication between a vacuum channel in the chuck and the vacuum grooves in the plate. The polymer film of the hoop assembly is disposed on the upper surface to seal the vacuum grooves to hold the film in place during scribing of materials placed on the film.

Scriber adapter plate

A laser bar loading and unloading apparatus is disclosed. The apparatus includes a mounting surface, a movable coating fixture having a plurality of spacers, and at least a first vacuum source for providing a vacuum on a laser bar mounted on the mounting surface. The spacers are movable to place a fully loaded fixture in a closed position and to place an empty fixture in an opened position. A second vacuum source directs a vacuum on a laser bar to assist in moving the laser bar into the fixture and onto one of the spacers. A third vacuum source directs a vacuum on the loaded laser bars to maintain their position in the fixture.

Automated laser bar transfer apparatus and method

A system is provided for trimming excess vinyl film from a hoop assembly. The hoop assembly may be used to manufacture semiconductor workpieces. The system uses a pressure applying member applied to the excess film with a bearing surface sufficient to receive such pressure on the opposite side of the excess film. The system may be rotated such that the film is trimmed around the entire hoop assembly at the position of the pressure applying member. The bearing surface may be part of the support for the system or incorporated into the hoops.

System for trimming excess material

A device and method for the automated rotating of semiconductor objects during the fabrication process is disclosed. The device uses a slotted base fixture with a channel, lifting members with ducts, and a vacuum. Semiconductor objects are rotated from a vertical position to a substantially horizontal essentially evenly spaced parallel configuration. The positioning of the semiconductor objects by the device is such that the facet end of each semiconductor object remains undisturbed. The configuration of the semiconductor objects allows for quick and easy transfer to a storage surface or transfer to further semiconductor processing steps.

Apparatus and method for rotating semiconductor objects

An apparatus and method for minimizing electrostatic discharge damage to semiconductor objects utilizes an ionized air stream to reduce electrostatic and triboelectric potential build up in and surrounding semiconductor storage containers. The ionized air stream is continuously directed to a designated area where stored semiconductor objects are being removed from. Electrostatic and triboelectric potential is greatly reduced, minimizing the threat of electrostatic discharge and damage.

Apparatus and method for minimizing electrostatic discharge damage to

A method and apparatus for preventing overspray onto bonding pads of a laser bar during facet coating includes manufacturing inserts with gaskets that are aligned with the laser bar such that the gaskets mask off the bonding pads during the facet coating process so that no overspray onto the bonding pads occurs. The gaskets are preferably made of gold with a thin titanium coating to prevent thermal compression bonding with the bonding pads. The inserts with gaskets are preferably manufactured using standard wafer processing techniques. The gaskets are preferably formed using the compliant layer metalization process described in U.S. Pat. No. 5,559,817.

Method for preventing facet coating overspray

In the manufacture of certain types of electronic devices, a plurality of leads are simultaneously bonded in side-by-side relation to a corresponding number of 'active' bonding sites or pads on a substrate, the 'active' pads being the ends of conductive paths on the substrate. Particularly narrow active bonding pads are used to minimize the possibility of shorting together adjacent pads by leads which are not properly aligned on centers with the pads. Electrically isolated 'dummy' pads, comprising relatively small metallized areas are not connected to conductive paths, are provided on the substrate between each active pad. Portions of the misaligned leads extending beyond the edges of the active pads overlap and are bonded to the dummy pads, thus minimizing the loss of bonding strength otherwise caused by the misalignment of the leads with the active pads.

Growing community of inventors

Reading, PA, United States of America

Raymond Frank Gruszka