Sun Microsystems, Inc.

Xilinx, Inc.

Raymond E Anderson

Larry D Smith

Tanmoy Roy

Suresh Ramalingam

Sungjun Chun

Paul Y Wu

Richard L Wheeler

Douglas W Forehand

Sarajuddin Niazi

Thomas J Pelc

Sanjay S Mehta

An apparatus for placement between a package and an integrated circuit board includes: an insert having: a substrate having a top side and a bottom side; a first set of pads at the top side of the substrate; a second set of pads at the bottom side of the substrate; and a plurality of vias in the substrate, the vias connecting respective pads in the first set to respective pads in the second set; wherein the insert has a thickness that is less than a spacing between the package and the integrated circuit board.

Low insertion loss package pin structure and method

A simulation model is provided for flip-chip BGAs to help engineers determine the effects of IC package components. The simulation model includes a bump model, a package planes model, a package bypass capacitor model, a ball model and a PCB model. The simulation model in particular includes resistors, inductors, capacitors and transmission lines to simulate the electrical interaction between signal conductors, power/ground planes, vias and balls that exist in a flip-chip ball grid array (BGA) package. The simulation model helps engineers understand actual physical effects of flip-chip and IC package interactions, as well as the impact of the effects of power supply droop, ground bounce and crosstalk between adjacent signals, not only on the IC package level, but at the computer system level.

Integrated circuit package component and ball grid array simulation model

A system and method for determining the desired decoupling components for a power distribution system having a voltage regulator module. The system may employ a mathematical model of a voltage regulator circuit, such as a switching voltage regulator. The mathematical model may be a SPICE model, or a circuit model in another format. The method may include simulating the operation of the power distribution system to obtain a estimate of the bulk capacitance required for effective decoupling. For digital systems, the method may include a cycle-by-cycle simulation of the power distribution system, wherein the simulation occurs over a number of clock cycles. The performance of the power distribution system may then be analyzed for each simulated clock cycle. The simulation may also include analyzing the transient responses and loop stability of the power distribution. Based on the results of these various simulations, the bulk capacitance value may be refined, thus allowing the system to begin the selection of specific decoupling components from the database in order to satisfy the bulk capacitance requirements.

System and method for determining the desired decoupling components for a power distribution system having a voltage regulator module

A methodology for determining the placement of decoupling capacitors in a power distribution system and system therefor is disclosed. In one embodiment, a method for determining the placement of decoupling capacitors in a power distribution system includes determining target impedance, creating a power distribution system model, performing an LC (inductive-capacitive) resonance analysis, and performing a cavity resonance analysis. During the performance of the LC resonance analysis, capacitors may be selected in order to suppress impedance peaks resulting from LC resonances. Following the LC resonance analysis, the method may place the capacitors in the power distribution system at evenly spaced intervals. During the performance of the cavity resonance analysis, the capacitors may be repositioned in the power distribution system so as to suppress cavity resonances.

Methodology for determining the placement of decoupling capacitors in a power distribution system

A system and method for determining the desired decoupling capacitors for power distribution systems having frequency dependent target impedance. In one embodiment, the target impedance may be a function of frequency, and thus may vary in value over a frequency range from 0 Hz to a corner frequency. A specific quantity of decoupling capacitors may be selected to provide decoupling for the power distribution for a given frequency within the frequency range. A total impedance provided by the specific quantity of selected decoupling capacitors may be calculated and compared to the calculated target impedance for the given frequency. If the total impedance provided by the specific quantity of selected decoupling capacitors is greater than the target impedance for the given frequency, the impedance may be adjusted by changing the quantity of capacitors. Capacitors may continue to be added until the total impedance is less than the target impedance. This may be performed for one or more frequencies within the calculated frequency range.

System and method for determining the decoupling capacitors for power distribution systems with a frequency-dependent target impedance

A system and method for analyzing simultaneous switching noise. In one embodiment, a model may be provided for the electronic circuit to be analyzed. The electronic circuit may be an integrated circuit, a multi-chip module, a printed circuit assembly, or other type, and may in some embodiments include combinations of these types. The electronic circuit may include a plurality of drivers, each of which may be coupled to a power plane, a ground plane, and a transmission line. The connection of the driver may be accurately modeled in this manner. Each driver may be configured to switch between a logic high voltage and a logic low voltage. The modeled electronic circuit may also include a voltage source coupled to the power plane and the ground plane, a voltage regulator module, and a plurality of decoupling capacitors. The simultaneous switching of a plurality of drivers, from a logic high to a logic low, or vice versa, may be simulated. The system and method may then allow for the calculation of solutions for the transmission line and the power planes (as will be detailed below). The transmission line solution and power plane solution may be superimposed on each other, which may allow for an analysis of plane bounce, which may include one or more fluctuations in the voltage between the power plane and the ground planes.

System and method for analyzing simultaneous switching noise

A method for determining the desired decoupling components for stabilizing the electrical impedance in the power distribution system of an electrical interconnecting apparatus, including a method for measuring the ESR for an electrical device, a method for determining a number of desired decoupling components for a power distribution system, and a method for placing the desired decoupling components in the power distribution system. The method creates a model of the power distribution system based upon an M&times;N grid for both the power plane and the ground plane. The model receives input from a user and from a database of various characteristics for a plurality of decoupling components. The method determines a target impedance over a desired frequency range. The method selects decoupling components. The method determines a number for each of the decoupling components chosen. The method places current sources in the model at spatial locations corresponding to physical locations of active components. The method optionally also places a power supply in the model. The method selects specific locations in the model to calculate transfer impedance values as a function of frequency. The method effectuates the model to determine the transfer impedance values as the function of frequency at the specific locations previously chosen. The method then compares the transfer impedance values as the function of frequency at the specific locations to the target impedance for the power distribution system. The method determines a bill of goods for the power distribution system based upon the results of effectuating the model.

Method for determining the desired decoupling components for power distribution systems

A system and method for using a computer system to determine the desired decoupling components for stabilizing the electrical impedance in the power distribution system of an electrical interconnecting apparatus, including a method for measuring the ESR for an electrical device, a method for determining a number of desired decoupling components for a power distribution system, and a method for placing the desired decoupling components in the power distribution system. The method creates a model of the power distribution system based upon an M&times;N grid for both the power plane and the ground plane. The model receives input from a user and from a database of various characteristics for a plurality of decoupling components. The method determines a target impedance over a desired frequency range. The method selects decoupling components. The method determines a number for each of the decoupling components chosen. The method places current sources in the model at spatial locations corresponding to physical locations of active components. The method optionally also places a power supply in the model. The method selects specific locations in the model to calculate transfer impedance values as a function of frequency. The method effectuates the model to determine the transfer impedance values as the function of frequency at the specific locations previously chosen. The method then compares the transfer impedance values as the function of frequency at the specific locations to the target impedance for the power distribution system.

System and method for determining the desired decoupling components for power distribution systems using a computer system

A system and method for measuring the equivalent series resistance (ESR) of one or more capacitors using an impedance analyzer, whereby the capacitors are joined to the impedance analyzer with a conductive adhesive. The conductive adhesive may advantageously provide for an electrically and mechanically stable connection between the capacitor and the remainder of the electrical circuit used to measure the ESR of the capacitor. The conductive adhesive may include heat activated or cold solder, or conductive putty. The system comprises a measuring unit for sweeping a frequency range to find the minimum impedance for the capacitor and a connector assembly for holding the capacitor in an electrically and mechanically stable connection using the conductive adhesive. The connector assembly includes a mating portion adapted for electrically connecting the connector assembly to an I/O port of the measuring unit and a terminal portion that accommodates a connection to the capacitor using the conductive adhesive. The method comprises connecting a mating portion of the connector assembly to the impedance analyzer. Next, the impedance analyzer is calibrated, and the capacitor is then connected to a terminal portion of the connector assembly using the conductive adhesive. Finally, the impedance analyzer sweeps a frequency range to find the ESR for the capacitor. The method may also measure the ESR of each of a number of capacitors using an impedance analyzer. The method may connect in series the number of capacitors to the connector assembly using the conductive adhesive. The method determines the equivalent series resistance of each of the number of capacitors by dividing the minimum impedance by the number of capacitors. The method may also comprise selecting one or more capacitors, measuring the ESR of each of the capacitors, and determining a desired number of each of the capacitors for placing into a power distribution system.

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Santa Cruz, CA, United States of America

Raymond E Anderson