International Business Machines Corporation

Raymond A Longhi

Edward Joseph Seminaro

Kevin Robert Covi

Raymond J Harrington

Gerald J Fahr

Frank E Bosco

Robert K Mullady

Gary Franklin Goth

Vincent P Mulligan

Steven G Shevach

Peter Adam Wendling

Keenan Wynn Franz

Anthony Joseph Cozzolino

Peter A Hein

Gerald Fahr

A method and related apparatus for servicing an electrical/electronic device during power shut offs is provided. The apparatus comprises a service logic having a memory and control component for storing device information during normal device operation and one or more indicators driven by the memory and control component after power shut off to provide service signals. The service logic also includes an auxiliary energy source selectively engageable to provide auxiliary power to the memory and control component during power shut off and to enable providing of service signals through the indicator(s).

Component indicators used during extended power-off service

Control of an AC-to-DC power supply assembly fed by a three-phase AC source is provided by: determining whether the power supply assembly includes greater than three single-phase power regulators feeding a common load, with multiple regulators being connected in parallel across a common phase of the AC source, and if so, summing currents provided by the regulators to the common load; and ascertaining whether the summed current is less than a predefined threshold, and if yes, operating the power supply assembly in a line balance mode to maintain power drawn on the phases of the AC source in balance, and if greater than the predefined threshold, operating the power supply assembly in a maximize power mode wherein power is provided to the common load without maintaining power drawn on the phases of the AC source in balance.

Control of an AC-to-DC power supply assembly fed by a three-phase AC source

A server including a cooling fan assembly and an input/output assembly at opposite ends of the server, and a processor assembly located between the cooling fan assembly and input/output assembly. The server also includes a cover plate that covers the processor assembly and cooling fan assembly and that has a power supply on the face of the cover plate facing the processor assembly and is electrically connected to the processor assembly.

Ultra dense multipurpose server

A technique for testing an electronics assembly for a power short circuit is provided. The technique includes pre-characterizing power off resistance of an electronic component(s) of a first packaging level from at least one power boundary of the electronic component(s). The characterizing of the power off resistance occurs prior to placement of the electronic component(s) into an electronics assembly of a higher packaging level. The technique further includes determining actual power off resistance of the electronics component(s) after placement thereof into the electronics assembly, with the actual power off resistance being determined from the at least one power boundary. Thereafter, the actual power off resistance of the electronic component(s) in the electronics assembly is compared with the pre-characterized power off resistance of the at least one electronic component(s), and a determination is made therefrom whether a power short circuit exists within the electronics assembly.

Power short circuit testing of an electronics assembly employing pre-characterized power off resistance of an electronic component thereof from a power boundary

A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.

Device for sensing temperature of an electronic chip

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Poughkeepsie, NY, United States of America

Raymond A Longhi