Intel Corporation

Raymond A Krick

Ravi V Mahajan

Robert Starkston

Michael L Rutigliano

Charles A Gealer

Edmond L Hart

John A Rabenius

Scot W Taylor

Farukh Fares

John J Beatty

Suzana Prstic

Shenavia S Howell

Embodiments may relate to a microelectronic package that includes a die and a backside metallization (BSM) layer positioned on the face of the die. The BSM layer may include a feature that indicates that the BSM layer was formed on the face of the die by a masked deposition technique. Other embodiments may be described or claimed.

Package-level backside metallization (BSM)

An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a &ldquo;shield&rdquo; about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.

EMI containment for microprocessor core mounted on a card using surface mounted clips

An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a 'shield' about the integrated circuit package so that any electro-magnetic field that flows from the package is grounded to the substrate.

EMI containment for microprocessor core mounted on a card using surface

Growing community of inventors

Gilbert, AZ, United States of America

Raymond A Krick