Lucent Technologies Inc.

Agere Systems Guardian Corp.

At+t Corp.

Agere Systems Inc.

Alcatel-lucent USA Inc.

Triquint Technology Holding Co.

Raymond A Cirelli

George Patrick Watson

Stanley K Pau

Nagesh R Basavanhally

Omkaram Nalamasu

Omar Daniel Lopez

Robert Waverly Zehner

Charles H Henry

Christopher Alan White

James Alexander Liddle

Henry H Yaffe

Sanjay Patel

Edward J Laskowski

Michele A Milbrodt

Michael Patrick Schlax

Masis Mkrtchyan

David Lee Windt

Lee Edward Trimble

The present invention provides an interconnect. The interconnect comprises a pliable surface having a plurality of nanostructures disposed thereon, the pliable surface configured to allow the plurality of nanostructures to at least partially conform to a surface when the nanostructures come into contact therewith.

Interconnect including a pliable surface and use thereof

A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

High density nanostructured interconnection

A MEMS device and a method for making a MEMS device are described. The MEMS device includes a support member, an optical device, and a flexible member. In one aspect, the flexible member is formed separately from the support member and the optical device. In one aspect, the flexible member is dimensioned to enable flex in one direction while maintaining stiffness in two orthogonal directions. In one fabrication embodiment, the MEMS device is formed by etching an opening into the structural layer to create a structural support member and an optical device. The structural support member and optical device are mounted on a support substrate with a sacrificial layer. A flexible member is conformally deposited over the structural support member and the optical device and then etched. The sacrificial layer is partially etched away to leave the structural support member anchored to the support substrate.

Micro-electro-mechanical system device and method of making same

An improved lithographic process for fabricating articles comprising photonic band gap materials with micron-scale periodicities is provided, the process readily capable of being performed by current lithographic processes and equipment. The process involves providing a three-dimensional structure made up of a plurality of stacked layers, where each layer contains a substantially planar lattice of shapes of a first material, typically silicon, with interstices between the shapes. Each shape contacts at least one shape of an adjacent layer, the interstices throughout the plurality of layers are interconnected, and the interstices comprise a second material, e.g., silicon dioxide. Typically, the second material is etched from the interconnected interstices to provide a structure of the first material and air, this structure designed to provide a particular photonic band gap.

Process for fabricating article comprising photonic band gap material

An improved attenuated phase-shifting mask (APSM) for use with an imaging tool for forming a patterned feature on a photoresist layer of a semiconductor wafer. The APSM has a transmissive region for substantially transmitting light therethrough to form a projected image substantially shaped as the patterned feature on the photoresist layer. The APSM also has an attenuating and phase-shifting region, contiguous with the transmissive region, for absorbing a portion of the light incident thereon and for shifting the phase of the incident light by a predetermined number of degrees relative to that of the light transmitted through the transmissive region so as to destructively interfere with the light transmitted through the transmissive region and to project a background image. The transmissive region has a dimension d dimensioned such that the intensity of the image projected by the transmissive region is darker than the intensity of the background image projected by the attenuating and phase-shifting region of the mask and that the intensity of the background image is substantially uniform.

Method of fabricating devices using an attenuated phase-shifting mask and an attenuated phase-shifting mask

A lithographic process for making an article such as a semiconductor device or a lithographic mask is disclosed. In the process, articles are fabricated by a sequence of steps in which materials are deposited on a substrate and patterned. These patterned layers are used to form devices on the semiconductor substrate. The desired pattern is formed by introducing an image of a first pattern in a layer of energy sensitive material. The image is then developed to form a first pattern. A layer of energy sensitive material is then formed over the first pattern. An image of a second pattern is then formed in the layer of energy sensitive material formed over the first pattern. The second pattern is then developed. The desired pattern is then developed from the first pattern and the second pattern.

Lithographic process having sub-wavelength resolution

A process for device fabrication is disclosed. In the process, optical lithography is used to introduce an image of a desired pattern into an energy sensitive material. In the process, a filter element is provided. The filter element has at least two regions of different transmittance, each region denominated an aperture. The regions are selected by obtaining information about the desired pattern and an optical lithographic tool that will be used to introduce the image of the desired pattern into the energy sensitive resist material. A filter element that provides an image that, when developed, will provide features with dimensions within acceptable process tolerances is then designed. The filter element is designed by modeling the effects of each aperture of the filter element on the intensity profile of an image of the desired pattern. The combined effect of the apertures is then determined. If required, an aspect (transmittance, orientation, dimension) of the one or more of the proposed apertures is adjusted to provide a modeled intensity profile that more closely corresponds to the desired lithographic result. Once the aspects of all apertures is determined, the filter element is fabricated and used in the optical lithographic process by placing the filter element in the optical lithography tool.

Process for device fabrication using a variable transmission aperture

A waveguide Bragg reflector is made by forming periodic grooves in either the undercladding or the core, applying a high index coating on the grooved surface and selectively removing the coating from the horizontal surfaces while leaving the coating on the vertical surfaces. The waveguide is then completed.

Method for making Bragg reflectors for waveguides

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Hillsborough, NJ, United States of America

Raymond A Cirelli