Oracle International Corporation

Ray Ping-kwan Chan

Ricki Dee Williams

Implementations of the present disclosure involve an apparatus and/or method for a large array of AC coupling/DC blocking capacitors on a printed circuit board (PCB) of a microelectronic circuit. The method provides for the placement of the blocking capacitors (and associated vias) to be placed on/through the PCB in a small area while yielding low crosstalk or interference between the vias. In one particular embodiment, the blocking capacitors are placed on the PCB in an alternating pattern, with a pair of blocking capacitors placed on the top side of the PCB followed by a pair of blocking capacitors on the bottom side of the PCB, and so on. Further, top side capacitor vias may be back-drilled from the bottom side and bottom side capacitor vias may be back-drilled from the top side.

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Cupertino, CA, United States of America

Ray Ping-kwan Chan