Amp LLC

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Ray N Shaak

John P Redmond

Charles Roscoe Brummett

Daniel Marshall Andrews

Albert Shirk

J A Crumley

Larry J Wilt

Dewey R Whitaker

An electrical connector 63 includes at least one length of wire 54 having an insulating means 55 with at least one portion 58 of the wire 54 extending free from the insulating means 55 and a housing 62 adapted to hold the free end 58 and a length of the insulating means relative to a first contact point 102 on an electrical article 100 to be interconnected with connector 63 to wire 54. Wire 54 includes one portion 56 inelastically deformed to provide a second contact point 60 adapted to engage said first contact point 102. Housing 62 includes portions adapted to position the second contact point 60 in bearing relationsip with the first contact point 102 with the spring beam 56 being deflected to provide a normal force engagement between the first and second 102, 60 contact points sufficient to assure a stable, low resistance interface.

Electrical connector and cable utilizing spring grade wire

An electrical connector (14) for interconnecting circuit boards (12, 50) includes an elastomeric pad (34, 36) having sharp fiber ends (42, 46) resiliently driven to penetrate oxides to provide an anisotropic, low resistance, stable electrical interface between the board circuits when driven by spring contacts (28, 32) in one embodiment, and by rigid contacts (64, 72) in another embodiment, wherein the pad is positioned to seal the interconnector by covering the connector interior.

Elastomeric connector with contact wipe

An electrical connector 63 includes at least one length of wire 54 having an insulating means 55 with at least one portion 58 of the wire 54 extending free from the insulating means 55 and a housing 62 adapted to hold the free end 58 and a length of the insulating means relative to a first contact point 102 on an electrical article 100 to be interconnected with connector 63 to wire 54. Wire 54 includes one portion 56 inelastically deformed to provide a second contact point 60 adapted to engage the first contact point 102. Housing 62 includes portions adapted to position the second contact point 60 in bearing relationship with the the first contact point 102 with the spring beam 56 being deflected to provide a normal force engagement between the first and second 102,60 contact points sufficient to assure a stable, low resistance interface.

A high density electrical connector assembly, and method of manufacturing same. More particularly, the invention covers an essentially flat, woven screen formed of a plurality of substantially parallel, electrically conductive wires forming the warp wires thereof, where such wires may be as small as 2 mils in diameter. Arranged essentially perpendicular thereto are plural, spaced apart, insulative woof filaments. To one major face of said flat, woven screen is applied a hot laminating film to encapsulate said wires, while to such other major face a comparable film is applied. However, for such other face, the encapsulating film is not coextensive with the screen length, but rather is spaced from the ends thereof so as to provide for connector contacts on each such wire. If desirable, the contacts may be plated. The invention also contemplates means for electrically interconnecting the assembly hereof to a high density circuit pattern, such as found on a PC board.

High density woven wire harness assembly

An environmentally sealed chip carrier housing for mounting on a printed circuit board. The housing is formed of a dielectric material and comprises a base and an upstanding circular side wall, one surface of which is threadably configured for receipt of a cover member. The base is further provided with plural slots for receiving a like plurality of elongated elastomeric compressive type connectors, and support means for receiving a chip carrier thereon. A cover member is provided for threadably engaging the housing. The cover member is characterized by a top having a peripheral wall thereabout, where the top has a uniformly convex configuration such that the center portion is thicker than the outer portions thereof. By this arrangement, when the cover member is positioned over the housing containing a chip carrier to threadably engage the cover member with said housing, a uniform pressure is applied to said chip carrier, which in turn will exert a uniform pressure against the elastomeric compressive type connectors. Further, the chip carrier is environmentally sealed.

Sealed chip carrier

Provided herein are novel layered elastomeric connectors, housings therefor and methods of manufacture for the connectors which includes alternating fused layers of a dielectric elastomer and electrically conductive fibrous mats coextensive with a cross section of the conductor to provide a multiplicity of conductive pathways between two electrically conductive surfaces. In order to promote a more mechanically stable connector, the fibrous mats can be exposed to a coupling agent for enhanced bonding. To enhance the electrical characteristics, the fibrous mats can be electroplated with an electrically conductive metal.

Process of making a layered elastomeric connector

An elastomeric connector assembly (2) is disclosed for making electrical contact between a first electrical component (52) and a second electrical component (54). The connector assembly has at least one housing member (4, 6) which has a plurality of terminals (12, 14) and an elastomeric connector (16, 18) provided therein. The elastomeric connector electrically engages the terminals to provide numerous electrical pathways which extend through the housing member (4, 6) of the connector assembly (2). A camming means (8, 10) is provided proximate the housing member (4, 6), such that as the camming means (8, 10) is moved from a first position to a second position, the elastomeric connector (16, 18) is compressed to insure that a reliable electrical connection is effected and maintained between the the first electrical component (52) and the elastomeric connection (16, 18), and between the elastomeric connector and the terminals (12, 14).

Elastomeric connector assembly

Ink compositions especially suitable for printing electronic circuit patterns on a substrate such as a flexible polyester substrate; methods for developing electrolessly and electrolytically the circuit configurations as articles of manufacture; flexographic printing with the ink composition has been disclosed as the preferred method.

Printed circuits

A method for the metallization of a nonconductive surface with gold, nickel or copper whereby on a nonconductive, relatively low temperature surface (such as a polyester or a polyolefin) a thermosensitive coordination complex of palladium (or platinum) is deposited from a solvent; the complex has the general formula LmPdXn wherein L is a ligand or unsaturated organic radical, X is a halide, alkyl group or a bidentate ligand and m is an integer from 1 to 4 and n is from 0 to 3; bis-benzonitrile palladium dichloride complex is an appropriate illustration; the palladium complex is applied in a thin film from a suitable nonaqueous solution solvent such as xylene, toluene or a chlorobenzene onto the surface of the nonconductive material and that thin film is thermally decomposed, such as by an infrared irradiation; the method in the preferred embodiment can be practiced without the necessity of surface etching or similar chemical conditioning of the polyester, polyamide, polyvinyl chloride, or polyolefin substrate prior to the catalytic coating; circuit element intermediates of said substrates are also disclosed.

Catalysts for electroless deposition of metals on comparatively

A solvent method for the metallization of a non-conductive surface with gold, nickel or copper is shown whereby on a substrate a thermosensitive coordination complex of palladium is deposited; the complex has the formula LmPdXn wherein L is a ligand or unsaturated organic radical, X is a halide, alkyl group or a bidentate ligand and m is an integer from 1 to 4 and n is from 0 to 3; trimethyl phosphite palladium dichloride complex is an appropriate illustration of the complex; the palladium complex is applied on the substrate in a suitable non-aqueous solution such as tetrahydrofuran solution; the complex is then baked in air at elevated temperature; the exposure to high temperature decomposes the complex leaving a residue which is catalytic to the deposition of gold, nickel, cobalt or copper from an electroless bath thereof; the non-conductive material is then immersed in an electroless bath to metallize the areas which have been rendered catalytic; the preferred thermosensitive coordination complex of palladium is trimethyl phosphite palladium dichloride; a requirement for a proper thermal exposure of the complex is that the substrate is capable of withstanding the elevated temperatures such as above 210.degree.C; illustrative organic substrates are polyimides, polysulfones, silicones, vulcanizates, fluoroplastics, polyphenylene sulfides, polyparabanic acids, and polyhydantoin, etc.

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Lebanon, PA, United States of America

Ray N Shaak