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Texas Instruments Corporation

Ray D Harrison

Kendall S Wills

Willmar E Subido

Jianbai Zhu

The present invention provides a system and method for preparing semiconductor integrated circuits (&ldquo;ICs&rdquo;), particularly ball grid arrays (&ldquo;BGAs&rdquo;), quad flat packs (&ldquo;QFPs&rdquo;) and dual in line packages (&ldquo;DIPs&rdquo;) for failure analysis (&ldquo;FA&rdquo;) using a variety of techniques, including emission microscopy (&ldquo;EM&rdquo;) and externally induced voltage alteration (&ldquo;XIVA&rdquo;). This system and method requires precision thinning and polishing of the semiconductor IC device to expose the backside of the die and mounting of the semiconductor device on a secondary package assembly.

Repackaging semiconductor IC devices for failure analysis

The invention adds a camping tent to pickup trucks by taking advantage of already-installed rigid pickup bed covers. Flexible tent material is adapted to be attached to the inside of a raised rigid cover, so that a tent is formed when the cover is lifted to its raised position above the bed of a pickup truck. The attachment is by means of a bracket installed on the underside of the cover. The tent is adapted to be quickly unfolded and attached to the tailgate and side panels of the truck with quick-release fastening means. Care is taken to prevent rain water from entering the shelter thus formed by folding the tent over the edge of the tailgate, attaching it to the side panels of the truck to form a water-tight interface, and providing rain flaps to deflect rain water over the fenders of the truck and away from the interior of the bed.

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Garland, TX, United States of America

Ray D Harrison