Alpha Assembly Solutions Inc.

Other

Fry's Metals, Inc.

Alpha Fry Limited

Ravindra Mohan Bhatkal

Siuli Sarkar

Bawa Singh

Ranjit Pandher

Sutapa Mukherjee

Narahari Pujari

Pritha Choudhury

Jayaprakash Sundaramurthy

Rahul Raut

Sanyogita Arora

Morgana De Avila Ribas

Bin Mo

Remya Chandran

Shamik Ghoshal

Pavan Vishwanath

Nicholas G Herrick

Thomas Meeus

Hans Korsse

Amit Patel

V Sathish Kumar

Dominic Lodge

Proloy Nandi

Kamanio Chattopadhyay

Arora Sanyogita

Paul Wilem Godijn

Tom Clara Louis Meeus

The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

Dielectric ink composition

Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.

Advanced solder alloys for electronic interconnects

Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

Sintering materials and attachment methods using same

A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.

Low temperature high reliability alloy for solder hierarchy

A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

Joining to aluminum

A method for providing metallization upon a semiconductor substrate utilizing a stencil having at least one aperture extending from the contact side to the fill side, the contact side of the stencil being substantially flat and forming a sharp edge with a wall of the at least one aperture, the at least one aperture being tapered such that an area of a cross-section of the at least one aperture at the fill side is larger than an area of the cross-section of the at least one aperture at the contact side. A method of forming a stencil for depositing metallization lines on a semiconductor substrate is also disclosed.

Electroformed stencils for solar cell front side metallization

Growing community of inventors

East Brunswick, NJ, United States of America

Ravindra Mohan Bhatkal